In order to provide continuous diagnostic and therapeutic options that exploit electrophysiological signals from the epidermis, this study discusses epidermal electronics systems (EES) that conform to the skin surface via van der Waals force alone, which is otherwise susceptible to artifacts associated with motion-induced changes. This paper not only establishes a criterion of conformal contact between the EES and the skin for both initial contact and the case where the skin is subject to external loading but also investigates the criterion to prevent any partial delamination between electronics and the skin. These results improve the performance of EES by maximizing intimate contact between the EES and skin, revealing important underlying physical insights for device optimization and future design.
Mechanics of Interfacial Delamination in Epidermal Electronics Systems
and Civil and Environmental Engineering,
Center for Engineering and Health,
and Skin Disease Research Center,
Manuscript received August 7, 2013; final manuscript received August 20, 2013; accepted manuscript posted August 28, 2013; published online October 16, 2013. Editor: Yonggang Huang.
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Cheng, H., and Wang, S. (October 16, 2013). "Mechanics of Interfacial Delamination in Epidermal Electronics Systems." ASME. J. Appl. Mech. April 2014; 81(4): 044501. https://doi.org/10.1115/1.4025305
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