The widely used steady-state energy release rate G = F/w is extended to account for the elastic energy of deformed compliant stamps, e.g., low-modulus poly(dimethyl siloxane) (PDMS). An analytical expression for the energy release rate is obtained to quantify interfacial adhesion strength in tape peeling tests, and to analyze the dynamics of kinetically controlled transfer printing. The critical delamination velocity to separate retrieval and printing is related to the critical energy release rate and the tensile stiffness of the stamp. Experimental results validate the analytical expression established by the mechanics model.

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