Epidermal electronic system (EES) is a class of integrated electronic systems that are ultrathin, soft, and lightweight, such that it could be mounted to the epidermis based on van der Waals interactions alone, yet provides robust, intimate contact to the skin. Recent advances on this technology will enable many medical applications such as to monitor brain or heart activities, to monitor premature babies, to enhance the control of prosthetics, or to realize human-machine interface. In particular, the contact between EES and the skin is key to high-performance functioning of the above applications and is studied in this paper. The mechanics concepts that lead to successful designs of EES are also discussed. The results, validated by finite element analysis and experimental observations, provide simple, analytical guidelines for design and optimization of EES with various possible functionalities.
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e-mail: y-huang@northwestern.edu
e-mail: jrogers@uiuc.edu
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Mechanics of Epidermal Electronics
Shuodao Wang,
Shuodao Wang
Department of Mechanical Engineering,
Northwestern University
, Evanston, IL 60208
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Ming Li,
Ming Li
State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, P. R. C.; Department of Civil and Environmental Engineering,
Northwestern University
, Evanston, IL 60208
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Jian Wu,
Jian Wu
Department of Engineering Mechanics,
Tsinghua University
, Beijing 100084, P. R. C.
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Dae-Hyeong Kim,
Dae-Hyeong Kim
School of Chemical and Biological Engineering,
Seoul National University
, Seoul, 151-744, Korea
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Nanshu Lu,
Nanshu Lu
Department of Aerospace Engineering and Engineering Mechanics,
University of Texas at Austin
, Austin, TX 78705
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Yewang Su,
Yewang Su
Department of Civil and Environmental Engineering,
Northwestern University
, Evanston, IL 60208
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Zhan Kang,
Zhan Kang
State Key Laboratory of Structural Analysis for Industrial Equipment,
Dalian University of Technology
, Dalian 116024, P. R. C.
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Yonggang Huang,
Yonggang Huang
Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208;Department of Civil and Environmental Engineering,
e-mail: y-huang@northwestern.edu
Northwestern University
, Evanston, IL 60208
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John A. Rogers
John A. Rogers
Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, and Frederick Seitz Materials Research Laboratory,
e-mail: jrogers@uiuc.edu
University of Illinois at Urbana-Champaign
, Urbana, IL 61801
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Shuodao Wang
Department of Mechanical Engineering,
Northwestern University
, Evanston, IL 60208
Ming Li
State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, P. R. C.; Department of Civil and Environmental Engineering,
Northwestern University
, Evanston, IL 60208
Jian Wu
Department of Engineering Mechanics,
Tsinghua University
, Beijing 100084, P. R. C.
Dae-Hyeong Kim
School of Chemical and Biological Engineering,
Seoul National University
, Seoul, 151-744, Korea
Nanshu Lu
Department of Aerospace Engineering and Engineering Mechanics,
University of Texas at Austin
, Austin, TX 78705
Yewang Su
Department of Civil and Environmental Engineering,
Northwestern University
, Evanston, IL 60208
Zhan Kang
State Key Laboratory of Structural Analysis for Industrial Equipment,
Dalian University of Technology
, Dalian 116024, P. R. C.
Yonggang Huang
Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208;Department of Civil and Environmental Engineering,
Northwestern University
, Evanston, IL 60208e-mail: y-huang@northwestern.edu
John A. Rogers
Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, and Frederick Seitz Materials Research Laboratory,
University of Illinois at Urbana-Champaign
, Urbana, IL 61801e-mail: jrogers@uiuc.edu
J. Appl. Mech. May 2012, 79(3): 031022 (6 pages)
Published Online: April 5, 2012
Article history
Received:
September 22, 2011
Revised:
November 23, 2011
Posted:
February 13, 2012
Published:
April 4, 2012
Online:
April 5, 2012
Citation
Wang, S., Li, M., Wu, J., Kim, D., Lu, N., Su, Y., Kang, Z., Huang, Y., and Rogers, J. A. (April 5, 2012). "Mechanics of Epidermal Electronics." ASME. J. Appl. Mech. May 2012; 79(3): 031022. https://doi.org/10.1115/1.4005963
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