Transient thermal stresses of a bimaterial specimen with interface cracks, under uniform cooling by convection, are analyzed by photothermoelasticity and a coupled temperature-displacement, finite element scheme. The stress intensity factors of the interface crack are determined by a multiparameter overdeterministic system of equations in a least-squares sense using the experimental data and by J-integral, numerically. The study showed that a normal temperature variation can lead to significant stresses due to the mismatch of thermal expansion coefficients.

1.
Kokini
,
K.
, and
Smith
,
C. C.
, 1989, “
Interfacial Transient Thermal Fracture of Adhesively Bonded Dissimilar Materials
,”
Exp. Mech.
,
29
, pp.
312
317
. 0014-4851
2.
Wang
,
W. C.
, and
Hsu
,
J. S.
, 2004, “
Re-Examination on Thermal Stresses of Bonded Structures
,”
J. Strain Anal. Eng. Des.
0309-3247,
39
, pp.
261
270
.
3.
Ileri
,
L.
, and
Madenci
,
E.
, 1995, “
Crack Initiation and Growth in Electronic Packages
,”
Proceedings of 45th Electronic Components and Technology Conference
, 1995, Las Vegas, NV, pp.
970
976
.
4.
Karthick Babu
,
P. R. D.
, and
Ramesh
,
K.
, 2006, “
Development of Fringe Plotting Scheme From 3D FE Results
,”
Commun. Numer. Methods Eng.
,
22
, pp.
809
821
. 1069-8299
5.
Ravichandran
,
M.
, and
Ramesh
,
K.
, 2005, “
Evaluation of Stress Field Parameters for an Interface Crack in a Bimaterial by Digital Photoelasticity
,”
J. Strain Anal. Eng. Des.
0309-3247,
40
, pp.
327
343
.
6.
Miskioglu
,
I.
,
Gryzagorides
,
J.
, and
Burger
,
C. P.
, 1981, “
Material Properties in Thermal-Stress Analysis
,”
Exp. Mech.
,
21
, pp.
295
301
. 0014-4851
7.
Benolina Neethi
,
S.
, and
Ramesh
,
K.
, 2007, “
Numerical and Digital Photoelastic Assessment of Bimaterial Interfaces in Electronic Packages
,”
ICTACEM
, IIT Kharaghpur.
8.
Holman
,
J. P.
, 2002,
Heat Transfer
,
9th ed.
,
McGraw-Hill
,
New York
, Chap. 7.
9.
2006, ABAQUS Version 6.6 Documentation, Dassault Systèmes Simulia Corp., Providence, RI.
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