Transient thermal stresses of a bimaterial specimen with interface cracks, under uniform cooling by convection, are analyzed by photothermoelasticity and a coupled temperature-displacement, finite element scheme. The stress intensity factors of the interface crack are determined by a multiparameter overdeterministic system of equations in a least-squares sense using the experimental data and by -integral, numerically. The study showed that a normal temperature variation can lead to significant stresses due to the mismatch of thermal expansion coefficients.
Digital Photothermoelastic and Numerical Analysis of Transient Thermal Stresses in Cracked Bimaterial Interfaces
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Neethi Simon, B., and Ramesh, K. (April 28, 2009). "Digital Photothermoelastic and Numerical Analysis of Transient Thermal Stresses in Cracked Bimaterial Interfaces." ASME. J. Appl. Mech. July 2009; 76(4): 044502. https://doi.org/10.1115/1.3086782
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