Like microelectronic circuits, microelectromechanical systems (MEMS) devices are susceptible to damage by electrostatic discharge (ESD). At Sandia National Laboratories, polysilicon electrothermal MEMS actuators have been subjected to ESD pulses to examine that susceptibility. Failures, in the form of cracks at points of high stress concentration, occurred that could not be explained by thermal degradation of the polysilicon caused by excessive heating, or by excessive displacement of the legs of the actuator of the same nature that occur in normal operation. One hypothesis presented in this paper is that the internal magnetic forces between the legs of the actuator, resulting from the ESD-associated high current pulses, might produce vibrations of amplitude sufficient to produce these cracks. However, a dynamic analysis based on simple beam theory indicated that such cracks are unlikely to occur, except under rather extreme conditions. On the other hand, these same current pulses also cause resistive heating of the legs and, therefore, thermally induced compression that can lead to buckling. Buckling stresses, particularly when augmented by magnetic forces, can readily explain failure. Both the magnetic and thermal analyses were performed using the human body model and the machine model of ESD. A justification for ignoring shuttle motion and eddy currents induced in the substrate during the ESD pulse is presented, as well.
Skip Nav Destination
e-mail: jdweiss@sandia.gov
Article navigation
September 2007
Technical Papers
Magnetic Force and Thermal Expansion as Failure Mechanisms of Electrothermal MEMS Actuators Under Electrostatic Discharge Testing
Jonathan D. Weiss
e-mail: jdweiss@sandia.gov
Jonathan D. Weiss
Sandia National Laboratories
, P.O. Box 5800, Mail Stop 1081, Albuquerque, NM 87185-1081
Search for other works by this author on:
Jonathan D. Weiss
Sandia National Laboratories
, P.O. Box 5800, Mail Stop 1081, Albuquerque, NM 87185-1081e-mail: jdweiss@sandia.gov
J. Appl. Mech. Sep 2007, 74(5): 996-1005 (10 pages)
Published Online: January 31, 2007
Article history
Received:
October 6, 2005
Revised:
January 31, 2007
Citation
Weiss, J. D. (January 31, 2007). "Magnetic Force and Thermal Expansion as Failure Mechanisms of Electrothermal MEMS Actuators Under Electrostatic Discharge Testing." ASME. J. Appl. Mech. September 2007; 74(5): 996–1005. https://doi.org/10.1115/1.2723813
Download citation file:
Get Email Alerts
Cited By
Sound Mitigation by Metamaterials With Low-Transmission Flat Band
J. Appl. Mech (January 2025)
Deformation-Dependent Effective Vascular Permeability of a Biological Tissue Containing Parallel Microvessels
J. Appl. Mech (January 2025)
Mechanics of a Tunable Bistable Metamaterial With Shape Memory Polymer
J. Appl. Mech (January 2025)
Related Articles
Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate
J. Electron. Packag (December,2003)
Low-Temperature Compressive Strength of Glass-Fiber-Reinforced
Polymer Composites
J. Offshore Mech. Arct. Eng (August,1994)
Temperature Dependence of the Mechanical Properties of GaAs Wafers
J. Electron. Packag (December,1991)
Device Process Integration: A New Device Fabrication Approach
J. Med. Devices (June,2010)
Related Proceedings Papers
Related Chapters
FAILURE ANALYSIS OF A STRESS-BASED PIPELINE UNDER PLASTIC STRAIN
Pipeline Integrity Management Under Geohazard Conditions (PIMG)
In Situ Observations of the Failure Mechanisms of Hydrided Zircaloy-4
Zirconium in the Nuclear Industry: 20th International Symposium
Members in Compression
Design & Analysis of ASME Boiler and Pressure Vessel Components in the Creep Range