This paper considers a mode III crack problem for a functionally graded piezoelectric material strip. The mechanical and electrical properties of the strip are considered for a class of functional forms for which the equilibrium equation has an analytical solution. The problem is solved by means of singular integral equation technique. Both a single crack and two collinear cracks are investigated. The results are tabulated and plotted to show the effect of the material nonhomogeneity and crack location on the stress and electric displacement intensity factors.
Issue Section:
Technical Papers
1.
Wang
, B. L.
, and Noda
, N.
, 2001
, “Thermally Induced Fracture of a Smart Functionally Graded Composite Structure
,” Theor. Appl. Fract. Mech.
, 35
(2
), pp. 93
–109
.2.
Li
, C.
, and Weng
, G. J.
, 2002
, “Antiplane Crack Problem in Functionally Graded Piezoelectric Materials
,” ASME J. Appl. Mech.
, 69
(4
), pp. 481
–488
.3.
Erdogan
, F.
, and Ozturk
, M.
, 1992
, “Diffusion Problems in Bonded Nonhomogeneous Materials With an Interface Cut
,” Int. J. Eng. Sci.
, 30
(10
), pp. 1507
–1523
.4.
Gradshteyn, I. S., and Ryzhik, I. M., 1965, Tables of Integrals, Series and Products, Academic Press, San Diego, CA.
5.
Erdogan
, F.
, and Wu
, B. H.
, 1996
, “Crack Problems in FGM Layers Under Thermal Stresses
,” J. Therm. Stresses
, 19
, pp. 237
–265
.Copyright © 2004
by ASME
You do not currently have access to this content.
