The mechanics of thin film epitaxy is developed using an equilibrium thermodynamics formalism and linear elasticity. A virtual variation approach is employed that leads to a direct identification of the important volume and surface thermodynamic parameters characterizing mechanical equilibrium. In particular, the equilibrium volume stress state of an epitaxial film as a function of the film thickness, surface free energies, and surface stresses is obtained. It is shown how this formalism can be used to determine the critical thickness for epitaxy.
Thermodynamics of Thin Film Epitaxy
Contributed by the Applied Mechanics Division of THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS for publication in the ASME JOURNAL OF APPLIED MECHANICS. Manuscript received by the ASME Applied Mechanics Division, March 15, 2001; final revision, December 10, 2001. Associate Editor: D. A. Kouris. Discussion on the paper should be addressed to the Editor, Professor Robert M. McMeeking, Department of Mechanical and Environmental Engineering University of California–Santa Barbara, Santa Barbara, CA 93106-5070, and will be accepted until four months after final publication of the paper itself in the ASME JOURNAL OF APPLIED MECHANICS.
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Cammarata, R. C., and Sieradzki, K. (June 20, 2002). "Thermodynamics of Thin Film Epitaxy ." ASME. J. Appl. Mech. July 2002; 69(4): 415–418. https://doi.org/10.1115/1.1468997
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