Stability of an inviscid axisymmetric jet of uniform surface tension and flexural rigidity is investigated. It is shown that for large enough values of flexural rigidity the capillary instabilities are suppressed. The result corroborates the observed stabilization and possible non-breakup of solder jets in the presence of atmospheric oxygen, which causes the appearance of a layer of oxides on the interface. The work is timely because of its direct relevance to a host of emerging technologies exemplified by solder jetting in the manufacturing of microelectronic components. [S0021-8936(00)01203-4]

1.
Hayes
,
D. J.
, and
Wallace
,
D. B.
,
1998
, “
Solder Jet Printing: Wafer Bumping and CSP Applications
,”
Chip Scale Review
,
2
, pp.
75
80
.
2.
Poulikakos
,
D.
, and
Waldvogel
,
J. M.
,
1996
, “
Heat Transfer and Fluid Dynamics in the Process of Spray Deposition
,”
Adv. Heat Transfer
,
28
, pp.
1
73
.
3.
Artemev
,
B. V.
, and
Kochetov
,
S. G.
,
1991
, “
Capillary Breakup of a Liquid-Metal Jet in an Oxidizing Medium
,”
J. Eng. Phys.
,
60
, pp.
425
429
.
4.
Ricci
,
E.
,
Castello
,
P.
, and
Passerone
,
A.
,
1994
, “
Liquid Metal Surface Tension Measurements: A Kinetic-Fluodynamic Model of Surface Oxygen Availability
,”
Mater. Sci. Eng.
,
A178
, pp.
99
104
.
5.
Simmonds
,
J. G.
,
1966
, “
A Set of Simple, Accurate Equations for Circular Cylindrical Elastic Shells
,”
Int. J. Solids Struct.
,
2
, pp.
525
541
.
6.
Drazin, P. G., and Reid, W. H., 1981, Hydrodynamic Stability, Cambridge University Press, Cambridge, UK.
You do not currently have access to this content.