Following a classical plate bending theory of magneto-elasticity, we consider the scattering of time-harmonic flexural waves by a through crack in a conducting plate under a uniform magnetic field normal to the crack surface. An incident wave giving rise to moments symmetric about the crack plane is applied. It is assumed that the plate has the electric and magnetic permeabilities of the free space. By the use of Fourier transforms we reduce the problem to solving a pair of dual integral equations. The solution of the dual integral equations is then expressed in terms of a Fredholm integral equation of the second kind. The dynamic moment intensity factor versus frequency is computed and the influence of the magnetic field on the normalized values is displayed graphically. It is found that the existence of the magnetic field produces higher singular moments near the crack tip.
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December 1997
Technical Papers
Flexural Wave Scattering at a Through Crack in a Conducting Plate Under a Uniform Magnetic Field
Y. Shindo,
Y. Shindo
Department of Materials Processing, Graduate School of Engineering, Tohoku University, Sendai 980-77, Japan
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I. Ohnishi,
I. Ohnishi
Toyota Motor Corporation, 1 Toyota-cho, Toyota 471, Japan
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S. Tohyama
S. Tohyama
Department of Materials Processing, Graduate School of Engineering, Tohoku University, Sendai 980-77, Japan
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Y. Shindo
Department of Materials Processing, Graduate School of Engineering, Tohoku University, Sendai 980-77, Japan
I. Ohnishi
Toyota Motor Corporation, 1 Toyota-cho, Toyota 471, Japan
S. Tohyama
Department of Materials Processing, Graduate School of Engineering, Tohoku University, Sendai 980-77, Japan
J. Appl. Mech. Dec 1997, 64(4): 828-834 (7 pages)
Published Online: December 1, 1997
Article history
Received:
April 21, 1995
Revised:
April 24, 1997
Online:
October 25, 2007
Citation
Shindo, Y., Ohnishi, I., and Tohyama, S. (December 1, 1997). "Flexural Wave Scattering at a Through Crack in a Conducting Plate Under a Uniform Magnetic Field." ASME. J. Appl. Mech. December 1997; 64(4): 828–834. https://doi.org/10.1115/1.2788988
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