Thermal Stresses in a Bimaterial Joint: An Experimental Analysis

An experimental analysis was conducted on a bimaterial plate subjected to a uniform change of temperature. Whole-field displacement measurements U and V were made on the free surface by means of high-sensitivity moire interferometry, and stresses were calculated from these data. Stresses resembled those of stress singularities, but they reached finite tensile and compressive peaks on opposite sides of the interface. The peaks and a severe stress gradient between them occurred in a narrow zone of about ±25 μm from the interface. The results pertain to an elastic three-dimensional body.