A problem of two bonded, dissimilar half-planes containing an elliptical hole on the interface is solved. The external load is uniform tension parallel to the interface. A rational mapping function and complex stress functions are used and an analytical solution is obtained. Stress distributions are shown. Stress concentration factors are also obtained for arbitrary lengths of debonding and for several material constants. In addition, an approximate expression of the stress concentration factor is given for elliptical holes and the accuracy is investigated.
Bonded Bi-material Half-Planes With Semi-elliptical Notch Under Tension Along the Interface
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Hasebe, N., Okumura, M., and Nakamura, T. (March 1, 1992). "Bonded Bi-material Half-Planes With Semi-elliptical Notch Under Tension Along the Interface." ASME. J. Appl. Mech. March 1992; 59(1): 77–83. https://doi.org/10.1115/1.2899467
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