We consider an axially symmetric elastic problem for a finite circular cylinder whose end planes are subjected to identical radial deformations. The obtained solution is used to evaluate low temperature strains and stresses for solder joints in assemblies having matched thermal expansion coefficients of the components. The thermomechanical behavior of solder joints is determined in this case by the mismatch between the solder and the soldered materials. It is shown that the arising strains and stresses, especially in the axial direction, can be rather great and could possibly result in the failure of the joint. They can be brought down by increasing its height-to-diameter ratio. The stresses can also be reduced if low modulus solder materials, such as 95 percent Pb/5 percent Sn solders or indium-based alloys, are used.
Skip Nav Destination
Article navigation
June 1989
Research Papers
Axisymmetric Elastic Deformations of a Finite Circular Cylinder With Application to Low Temperature Strains and Stresses in Solder Joints
E. Suhir
E. Suhir
AT&T Bell Laboratories, Murray Hill, N.J. 07974
Search for other works by this author on:
E. Suhir
AT&T Bell Laboratories, Murray Hill, N.J. 07974
J. Appl. Mech. Jun 1989, 56(2): 328-333 (6 pages)
Published Online: June 1, 1989
Article history
Received:
June 27, 1988
Revised:
September 9, 1988
Online:
July 21, 2009
Citation
Suhir, E. (June 1, 1989). "Axisymmetric Elastic Deformations of a Finite Circular Cylinder With Application to Low Temperature Strains and Stresses in Solder Joints." ASME. J. Appl. Mech. June 1989; 56(2): 328–333. https://doi.org/10.1115/1.3176087
Download citation file:
Get Email Alerts
Rigorous Analysis of Energy Conservation During Dynamic Deployment of Elastic Thin-Shell Structures
J. Appl. Mech (January 2024)
Thermomechanical Coupling in Polydomain Liquid Crystal Elastomers
J. Appl. Mech (February 2024)
Related Articles
Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions
J. Electron. Packag (September,2005)
Behavior of Lead-Free Solder Under Thermomechanical Loading
J. Electron. Packag (September,2004)
Thermomechanical Fatigue Testing and Analysis of Solder Alloys
J. Electron. Packag (March,2000)
A Damage-Mechanics-Based Constitutive Model for Solder Joints
J. Electron. Packag (September,2005)
Related Proceedings Papers
Constitutive Modeling of Lead-Free Solders
InterPACK2005
Related Chapters
Microstructure Evolution and Physics-Based Modeling
Ultrasonic Welding of Lithium-Ion Batteries
Structural Performance of Thermo-Active Foundations
Thermoactive Foundations for Sustainable Buildings
Design for Displacement Strains
Process Piping: The Complete Guide to ASME B31.3, Fourth Edition