The objective of this paper is to develop the technique of the embedded grid for three-dimensional strain and stress analysis. The application to the case of a sphere subjected to diametral loading is described and results are compared with theoretical and photoelastic ones. The limitations of the method are outlined and suggestions for improvement made. As it stands now, the method allows the nondestructive determination of three-dimensional strain fields with good precision. The determination of stresses, however, is less precise.

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