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Proceedings Papers

A Material Removal Rate Model Considering Interfacial Micro-Contact Wear Behavior for Chemical Mechanical Polishing

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Yeau-Ren Jeng, Pay-Yau Huang
Proc. ASME. WTC2005, World Tribology Congress III, Volume 1, 239-240, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63260
https://doi.org/10.1115/WTC2005-63260
... removal rate micro-contact wear interfacial phenomena Proceedings of WTC2005 World Tribology Congress III September 12-16, 2005, Washington, D.C., USA Proceedings of WTC2005 World Tribology Congress III September 12-16, 2005, Washington, D.C., USA 1 Copyright © 2005 by ASME Chemical Mechanical...
View Paper titled, A Material Removal Rate Model Considering Interfacial Micro-Contact Wear Behavior for Chemical Mechanical Polishing
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Topics: Interface phenomena, Polishing, Wear, Particulate matter, Semiconductor wafers, Slurries, Deformation, Particle size