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Keywords: interfacial phenomena
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Proceedings Papers

A Material Removal Rate Model Considering Interfacial Micro-Contact Wear Behavior for Chemical Mechanical Polishing

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Yeau-Ren Jeng, Pay-Yau Huang
Proc. ASME. WTC2005, World Tribology Congress III, Volume 1, 239-240, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63260
https://doi.org/10.1115/WTC2005-63260
... wafer surface hardness, slurry particle size, and slurry concentration. This study also provides physical insights into the interfacial phenomena not discussed by previous models, which ignored the effects of abrasive particles between the polishing interfaces during force balancing. CMP material...
View Paper titled, A Material Removal Rate Model Considering Interfacial Micro-Contact Wear Behavior for Chemical Mechanical Polishing
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Topics: Interface phenomena, Polishing, Wear, Particulate matter, Semiconductor wafers, Slurries, Deformation, Particle size