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Proceedings Papers

Roles of Surfactant Molecules in Post-CMP Cleaning

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Dedy Ng, Milind Kulkarni, Hong Liang
Proc. ASME. WTC2005, World Tribology Congress III, Volume 1, 941-942, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-64358
https://doi.org/10.1115/WTC2005-64358
View Paper titled, Roles of Surfactant Molecules in Post-CMP Cleaning
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Topics: Surfactants, Particulate matter, Ceramic matrix composites, Contamination, Friction, Nanoparticles, Polishing, Semiconductor wafers, Slurries, Temperature
Proceedings Papers

Two-Phase Hydrodynamic Modeling of Particulate Fluids in Sliding Contacts

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Elon Terrell, Jonathan Garcia, C. Fred Higgs, III
Proc. ASME. WTC2005, World Tribology Congress III, Volume 1, 511-512, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63778
https://doi.org/10.1115/WTC2005-63778
View Paper titled, Two-Phase Hydrodynamic Modeling of Particulate Fluids in Sliding Contacts
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Topics: Fluids, Modeling, Particulate matter, Semiconductor wafers, Slurries, Polishing, Wear, Manufacturing, Pressing
Proceedings Papers

Dishing and Erosion in Cu-CMP

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Inho Yoon, Sum Huan Ng, Andres Osorno, Steven Danyluk
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 459-460, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63978
https://doi.org/10.1115/WTC2005-63978
View Paper titled, Dishing and Erosion in Cu-CMP
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Topics: Erosion, Copper, Polishing, Semiconductor wafers, Geometry, Slurries, Complementary metal oxide semiconductors, Density, Etching, Microelectromechanical systems
Proceedings Papers

A Material Removal Rate Model Considering Interfacial Micro-Contact Wear Behavior for Chemical Mechanical Polishing

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Yeau-Ren Jeng, Pay-Yau Huang
Proc. ASME. WTC2005, World Tribology Congress III, Volume 1, 239-240, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63260
https://doi.org/10.1115/WTC2005-63260
View Paper titled, A Material Removal Rate Model Considering Interfacial Micro-Contact Wear Behavior for Chemical Mechanical Polishing
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Topics: Interface phenomena, Polishing, Wear, Particulate matter, Semiconductor wafers, Slurries, Deformation, Particle size
Proceedings Papers

Movements and Collisions of Nanoparticles in Two Phase Flow

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Jianbin Luo, Xuefeng Xu, Jing Yan, Fangli Duan, Xinchun Lu
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 355-356, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63442
https://doi.org/10.1115/WTC2005-63442
View Paper titled, Movements and Collisions of Nanoparticles in Two Phase Flow
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Topics: Collisions (Physics), Nanoparticles, Two-phase flow, Flow (Dynamics), Fluids, Oils, Particulate matter, Petroleum, Slurries, Tribology
Proceedings Papers

On Direct Measurement of Forces Between CMP Polishing Pads and Abrasive Nanoparticles

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I. Sokolov, Q. K. Ong, N. Chechik, D. James
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 503-504, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-64160
https://doi.org/10.1115/WTC2005-64160
View Paper titled, On Direct Measurement of Forces Between CMP Polishing Pads and Abrasive Nanoparticles
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Topics: Nanoparticles, Polishing, Atomic force microscopy, Particulate matter, Urethane elastomers, Adhesion, Epoxy adhesives, Epoxy resins, Slurries
Proceedings Papers

A Methodology to Reduce the Wafer to Wafer Thickness Variation in Chemical Mechanical Planarization (CMP)

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Sim Kit Wang, David Lee Butler
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 507-508, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-64194
https://doi.org/10.1115/WTC2005-64194
View Paper titled, A Methodology to Reduce the Wafer to Wafer Thickness Variation in Chemical Mechanical Planarization (CMP)
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Topics: Semiconductor wafers, Film thickness, Flow (Dynamics), Contact mechanics, Integrated circuit fabrication, Pressure, Slurries
Proceedings Papers

Quantitative In-Situ Measurement of Asperity Compression During Chemical Mechanical Planarization

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Caprice Gray, Daniel Apone, Chris Rogers, Vincent P. Manno, Chris Barns, Mansour Moinpour, Sriram Anjur, Ara Philipossian
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 425-426, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63805
https://doi.org/10.1115/WTC2005-63805
View Paper titled, Quantitative In-Situ Measurement of Asperity Compression During Chemical Mechanical Planarization
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Topics: Calibration, Compressibility, Compression, Emissions, Film thickness, Fluorescence, Lasers, Polishing, Resolution (Optics), Semiconductor wafers
Proceedings Papers

The Relative Friction Force Contributions of Polishing Pads and Slurries During Chemical Mechanical Polishing

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Joseph A. Levert, Chad S. Korach
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 427-428, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63817
https://doi.org/10.1115/WTC2005-63817
View Paper titled, The Relative Friction Force Contributions of Polishing Pads and Slurries During Chemical Mechanical Polishing
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Topics: Friction, Polishing, Slurries, Nanoscale phenomena, Dielectric materials, Damage, Integrated circuits, Particulate matter, Shear (Mechanics), Silicon
Proceedings Papers

Chemical Mechanical Polishing Slurry for Tungsten in ULSI With Large Particle Size Colloidal Silica Nano-Abrasive

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Kailiang Zhang, Zhitang Song, Songlin Feng
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 515-516, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-64249
https://doi.org/10.1115/WTC2005-64249
View Paper titled, Chemical Mechanical Polishing Slurry for Tungsten in ULSI With Large Particle Size Colloidal Silica Nano-Abrasive
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Topics: Particle size, Polishing, Slurries, Tungsten
Proceedings Papers

Single Asperity Atomic Force Microscope Studies of the CMP of Silicate Glasses

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Stephen C. Langford, Forrest Stevens, J. Thomas Dickinson
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 451-452, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63932
https://doi.org/10.1115/WTC2005-63932
View Paper titled, Single Asperity Atomic Force Microscope Studies of the CMP of Silicate Glasses
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Topics: Atomic force microscopy, Glass, Stress, Wear, Nanoscale phenomena, Particulate matter, Slurries
Proceedings Papers

Investigation of Copper CMP Mechanisms Using an Atomic Force Microscope

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Milind Kulkarni, Dedy Ng, Hong Liang
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 385-386, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63587
https://doi.org/10.1115/WTC2005-63587
View Paper titled, Investigation of Copper CMP Mechanisms Using an Atomic Force Microscope
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Topics: Atomic force microscopy, Copper, Polishing, Chemistry, Slurries, Stress
Proceedings Papers

Copper CMP Mimicked With Atomic Force Microscopy

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Igor Sokolov
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 471-472, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-64018
https://doi.org/10.1115/WTC2005-64018
View Paper titled, Copper CMP Mimicked With Atomic Force Microscopy
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Topics: Atomic force microscopy, Copper, Polishing, Particulate matter, Slurries, Friction
Proceedings Papers

Friction Behavior of CMP Slurries Based on Novel Organic Particles

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Yuzhuo Li, Ning Wang
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 475-476, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-64023
https://doi.org/10.1115/WTC2005-64023
View Paper titled, Friction Behavior of CMP Slurries Based on Novel Organic Particles
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Topics: Friction, Particulate matter, Slurries, Copper, Polishing, Abrasives, Atomic, molecular, and chemical characteristics, Dielectric materials, Hydrophobicity, Metal surfaces
Proceedings Papers

Nano Particles’ Behavior in Chemical Mechanical Polishing With the Effect of Non-Newtonian Properties of Slurry

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Haosheng Chen, Darong Chen, Jiadao Wang
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 309-310, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63170
https://doi.org/10.1115/WTC2005-63170
View Paper titled, Nano Particles’ Behavior in Chemical Mechanical Polishing With the Effect of Non-Newtonian Properties of Slurry
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Topics: Nanoparticles, Polishing, Slurries, Fracture (Materials), Fracture (Process), Pressure, Fatigue, Film thickness, Particle size, Particulate matter
Proceedings Papers

Use of Electrochemical Techniques in CMP Process Evaluation

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Vlasta Brusic
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 497-498, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-64134
https://doi.org/10.1115/WTC2005-64134
View Paper titled, Use of Electrochemical Techniques in CMP Process Evaluation
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Topics: Alloys, Aluminum, Copper, Corrosion, Magnetic materials, Metals, Polishing, Probes, Slurries, Tungsten