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Proceedings Papers

Roles of Surfactant Molecules in Post-CMP Cleaning

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Dedy Ng, Milind Kulkarni, Hong Liang
Proc. ASME. WTC2005, World Tribology Congress III, Volume 1, 941-942, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-64358
https://doi.org/10.1115/WTC2005-64358
View Paper titled, Roles of Surfactant Molecules in Post-CMP Cleaning
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Topics: Surfactants, Particulate matter, Ceramic matrix composites, Contamination, Friction, Nanoparticles, Polishing, Semiconductor wafers, Slurries, Temperature
Proceedings Papers

Two-Phase Hydrodynamic Modeling of Particulate Fluids in Sliding Contacts

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Elon Terrell, Jonathan Garcia, C. Fred Higgs, III
Proc. ASME. WTC2005, World Tribology Congress III, Volume 1, 511-512, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63778
https://doi.org/10.1115/WTC2005-63778
View Paper titled, Two-Phase Hydrodynamic Modeling of Particulate Fluids in Sliding Contacts
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Topics: Fluids, Modeling, Particulate matter, Semiconductor wafers, Slurries, Polishing, Wear, Manufacturing, Pressing
Proceedings Papers

Global Planarization Requirements for Wafer-Level Three-Dimensional (3D) ICs

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R. J. Gutmann, J. J. McMahon, J.-Q. Lu
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 365-366, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63492
https://doi.org/10.1115/WTC2005-63492
View Paper titled, Global Planarization Requirements for Wafer-Level Three-Dimensional (3D) ICs
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Topics: Semiconductor wafers, Bonding, Density, Dimensions, Industrial research, Integrated circuits, Manufacturing, Stress
Proceedings Papers

Dishing and Erosion in Cu-CMP

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Inho Yoon, Sum Huan Ng, Andres Osorno, Steven Danyluk
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 459-460, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63978
https://doi.org/10.1115/WTC2005-63978
View Paper titled, Dishing and Erosion in Cu-CMP
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Topics: Erosion, Copper, Polishing, Semiconductor wafers, Geometry, Slurries, Complementary metal oxide semiconductors, Density, Etching, Microelectromechanical systems
Proceedings Papers

Development of a Combined Analytical and Empirical Model for Beveling of Quartz Crystal Wafers

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Chensong (Jonathan) Dong
Proc. ASME. WTC2005, World Tribology Congress III, Volume 1, 841-842, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-64254
https://doi.org/10.1115/WTC2005-64254
View Paper titled, Development of a Combined Analytical and Empirical Model for Beveling of Quartz Crystal Wafers
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Topics: Quartz crystals, Semiconductor wafers, Crystals, Design, Errors, Modeling, Optimization
Proceedings Papers

A Material Removal Rate Model Considering Interfacial Micro-Contact Wear Behavior for Chemical Mechanical Polishing

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Yeau-Ren Jeng, Pay-Yau Huang
Proc. ASME. WTC2005, World Tribology Congress III, Volume 1, 239-240, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63260
https://doi.org/10.1115/WTC2005-63260
View Paper titled, A Material Removal Rate Model Considering Interfacial Micro-Contact Wear Behavior for Chemical Mechanical Polishing
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Topics: Interface phenomena, Polishing, Wear, Particulate matter, Semiconductor wafers, Slurries, Deformation, Particle size
Proceedings Papers

Sliding Friction of Polymers: The Complex Role of Interface

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S. Bistac, Marjorie Schmitt, Achraf Ghorbal
Proc. ASME. WTC2005, World Tribology Congress III, Volume 1, 291-292, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63480
https://doi.org/10.1115/WTC2005-63480
View Paper titled, Sliding Friction of Polymers: The Complex Role of Interface
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Topics: Elastomers, Friction, Plasma desorption mass spectrometry, Polymers, Sliding friction, Glass transition, Semiconductor wafers, Stiffness, Surface roughness, Tribology
Proceedings Papers

CMP and Nano-Characterization of Magnetic Head Wafer Films

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Jonathan Garcia, Elon Terrell, C. Fred Higgs, III
Proc. ASME. WTC2005, World Tribology Congress III, Volume 1, 737-738, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63704
https://doi.org/10.1115/WTC2005-63704
View Paper titled, CMP and Nano-Characterization of Magnetic Head Wafer Films
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Topics: Data storage systems, Magnetic heads, Mechanical properties, Nanotechnology, Polishing, Semiconductor wafers, Semiconductors (Materials), Storage, Stress
Proceedings Papers

Experimental Observation of Fractal-Regular Surfaces and a Transformation Scheme for Extracting Fractal Parameters

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Shao Wang, Wai Kin Chan
Proc. ASME. WTC2005, World Tribology Congress III, Volume 1, 319-320, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63585
https://doi.org/10.1115/WTC2005-63585
View Paper titled, Experimental Observation of Fractal-Regular Surfaces and a Transformation Scheme for Extracting Fractal Parameters
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Topics: Fractals, Disks, Semiconductor wafers, Dimensions, Shapes, Spectral energy distribution, Surface roughness
Proceedings Papers

A Geometrically Defined All-Diamond Pad Conditioner

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Joakim Andersson, Markus Forsberg, Patrik Hollman, Staffan Jacobson
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 361-362, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63472
https://doi.org/10.1115/WTC2005-63472
View Paper titled, A Geometrically Defined All-Diamond Pad Conditioner
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Topics: Diamonds, Anisotropy, Etching, Process control, Semiconductor wafers, Silicon, Synthetic diamonds
Proceedings Papers

A Methodology to Reduce the Wafer to Wafer Thickness Variation in Chemical Mechanical Planarization (CMP)

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Sim Kit Wang, David Lee Butler
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 507-508, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-64194
https://doi.org/10.1115/WTC2005-64194
View Paper titled, A Methodology to Reduce the Wafer to Wafer Thickness Variation in Chemical Mechanical Planarization (CMP)
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Topics: Semiconductor wafers, Film thickness, Flow (Dynamics), Contact mechanics, Integrated circuit fabrication, Pressure, Slurries
Proceedings Papers

Friction Characteristics of Self-Assembled Monolayers Coated on Si-Wafer by Chemical Vapor Deposition at Nano/Micro-Scale

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Arvind R. Singh, Eui-Sung Yoon, Hung-Gu Han, Hosung Kong
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 751-752, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63417
https://doi.org/10.1115/WTC2005-63417
View Paper titled, Friction Characteristics of Self-Assembled Monolayers Coated on Si-Wafer by Chemical Vapor Deposition at Nano/Micro-Scale
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Topics: Chemical vapor deposition, Friction, Microscale devices, Self-assembly, Semiconductor wafers, Adhesion, Atomic force microscopy, Chemical properties, Nanoscale phenomena, Testing equipment
Proceedings Papers

Quantitative In-Situ Measurement of Asperity Compression During Chemical Mechanical Planarization

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Caprice Gray, Daniel Apone, Chris Rogers, Vincent P. Manno, Chris Barns, Mansour Moinpour, Sriram Anjur, Ara Philipossian
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 425-426, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63805
https://doi.org/10.1115/WTC2005-63805
View Paper titled, Quantitative In-Situ Measurement of Asperity Compression During Chemical Mechanical Planarization
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Topics: Calibration, Compressibility, Compression, Emissions, Film thickness, Fluorescence, Lasers, Polishing, Resolution (Optics), Semiconductor wafers
Proceedings Papers

Effect of Colloidal Probe Random Surface Features on Adhesion

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Seung Ho Yang, Stephen M. Hsu
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 779-780, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63701
https://doi.org/10.1115/WTC2005-63701
View Paper titled, Effect of Colloidal Probe Random Surface Features on Adhesion
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Topics: Adhesion, Probes, Atomic force microscopy, Adhesives, Stress, Glass, Bearings, Cantilevers, Contact mechanics, Imaging
Proceedings Papers

Appling Micro Devices to Scanning Probe Microscopes for Micro/Nano Tribology Study (Keynote)

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Yasuhisa Ando, Shiraishi Naoki
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 715-716, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63642
https://doi.org/10.1115/WTC2005-63642
View Paper titled, Appling Micro Devices to Scanning Probe Microscopes for Micro/Nano Tribology Study (Keynote)
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Topics: Nanotribology, Scanning probe microscopy, Microelectromechanical systems, Silicon-on-insulator, Force sensors, Semiconductor wafers, Tribology
Proceedings Papers

Nano-Particle Interaction During Chemical-Mechanical Polishing

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Dedy Ng, Milind Kulkarni, Hong Liang, Yeau-Ren Jeng, Pai-Yau Huang
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 389-390, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63591
https://doi.org/10.1115/WTC2005-63591
View Paper titled, Nano-Particle Interaction During Chemical-Mechanical Polishing
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Topics: Nanoparticles, Polishing, Particulate matter, Numerical analysis, Semiconductor wafers, Stress, Wear
Proceedings Papers

Friction Behavior of CMP Slurries Based on Novel Organic Particles

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Yuzhuo Li, Ning Wang
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 475-476, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-64023
https://doi.org/10.1115/WTC2005-64023
View Paper titled, Friction Behavior of CMP Slurries Based on Novel Organic Particles
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Topics: Friction, Particulate matter, Slurries, Copper, Polishing, Abrasives, Atomic, molecular, and chemical characteristics, Dielectric materials, Hydrophobicity, Metal surfaces
Proceedings Papers

Tribological Process Characterization With In-Situ Quantitative Nano-Scale Metrology

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Antanas Daugela, Alex Meyman, Vladimir Knyazik, Nikolai Yeremin
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 803-804, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63834
https://doi.org/10.1115/WTC2005-63834
View Paper titled, Tribological Process Characterization With In-Situ Quantitative Nano-Scale Metrology
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Topics: Finite element model, Imaging, Mechanical properties, Metrology, Nanoindentation, Nanoscale phenomena, Optical microscopes, Scanning probe microscopy, Semiconductor wafers, Tribology
Proceedings Papers

Nano Particles’ Behavior in Chemical Mechanical Polishing With the Effect of Non-Newtonian Properties of Slurry

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Haosheng Chen, Darong Chen, Jiadao Wang
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 309-310, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63170
https://doi.org/10.1115/WTC2005-63170
View Paper titled, Nano Particles’ Behavior in Chemical Mechanical Polishing With the Effect of Non-Newtonian Properties of Slurry
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Topics: Nanoparticles, Polishing, Slurries, Fracture (Materials), Fracture (Process), Pressure, Fatigue, Film thickness, Particle size, Particulate matter
Proceedings Papers

The Effects of Silicone Oil Contamination on the Contact Resistance of MEMS Electrical Contact Surfaces

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D. J. Dickrell, III, M. T. Dugger
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 807-808, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63843
https://doi.org/10.1115/WTC2005-63843
View Paper titled, The Effects of Silicone Oil Contamination on the Contact Resistance of MEMS Electrical Contact Surfaces
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Topics: Contact resistance, Contamination, Microelectromechanical systems, Silicones, Stress, Cycles, Metals, Peak load, Reliability, Adhesion