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Proceedings Papers

Relating Friction in CMP to Topography Evolution

Available to Purchase

Xiaolin Xie, Duane Boning
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 493-494, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-64115
https://doi.org/10.1115/WTC2005-64115
View Paper titled, Relating Friction in CMP to Topography Evolution
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Topics: Friction, Copper, Density, Engines, Erosion, Film thickness, Integrated circuit fabrication, Motors, Polishing, Wear
Proceedings Papers

A Methodology to Reduce the Wafer to Wafer Thickness Variation in Chemical Mechanical Planarization (CMP)

Available to Purchase

Sim Kit Wang, David Lee Butler
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 507-508, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-64194
https://doi.org/10.1115/WTC2005-64194
View Paper titled, A Methodology to Reduce the Wafer to Wafer Thickness Variation in Chemical Mechanical Planarization (CMP)
Open the PDF for A Methodology to Reduce the Wafer to Wafer Thickness Variation in Chemical Mechanical Planarization (CMP) in another window
Topics: Semiconductor wafers, Film thickness, Flow (Dynamics), Contact mechanics, Integrated circuit fabrication, Pressure, Slurries