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Proceedings Papers

The Relative Friction Force Contributions of Polishing Pads and Slurries During Chemical Mechanical Polishing

Available to Purchase

Joseph A. Levert, Chad S. Korach
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 427-428, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63817
https://doi.org/10.1115/WTC2005-63817
View Paper titled, The Relative Friction Force Contributions of Polishing Pads and Slurries During Chemical Mechanical Polishing
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Topics: Friction, Polishing, Slurries, Nanoscale phenomena, Dielectric materials, Damage, Integrated circuits, Particulate matter, Shear (Mechanics), Silicon
Proceedings Papers

Friction Behavior of CMP Slurries Based on Novel Organic Particles

Available to Purchase

Yuzhuo Li, Ning Wang
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 475-476, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-64023
https://doi.org/10.1115/WTC2005-64023
View Paper titled, Friction Behavior of CMP Slurries Based on Novel Organic Particles
Open the PDF for Friction Behavior of CMP Slurries Based on Novel Organic Particles in another window
Topics: Friction, Particulate matter, Slurries, Copper, Polishing, Abrasives, Atomic, molecular, and chemical characteristics, Dielectric materials, Hydrophobicity, Metal surfaces
Proceedings Papers

The Effects of Silicone Oil Contamination on the Contact Resistance of MEMS Electrical Contact Surfaces

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D. J. Dickrell, III, M. T. Dugger
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 807-808, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63843
https://doi.org/10.1115/WTC2005-63843
View Paper titled, The Effects of Silicone Oil Contamination on the Contact Resistance of MEMS Electrical Contact Surfaces
Open the PDF for The Effects of Silicone Oil Contamination on the Contact Resistance of MEMS Electrical Contact Surfaces in another window
Topics: Contact resistance, Contamination, Microelectromechanical systems, Silicones, Stress, Cycles, Metals, Peak load, Reliability, Adhesion