Microscopic devices that can perform sensing, actuation, and control, known as microelectromechanical systems (MEMS), are projected to lead to new technologies with profound impacts in science and engineering. However, there are several limitations that must be overcome before MEMS could be fully utilized in various applications. In particular, because of the low stiffness and large surface-to-volume ratio of MEMS, high adhesion and friction forces between proximity and contacting surfaces limit the device efficiency and often lead to premature failure. Basic study of adhesion and friction under MEMS conditions requires special microdevices fabricated by surface micromachining. The basic features of such MEMS devices are presented herein together with suitable surface modification techniques for reducing surface adhesion and friction, such as surface texturing and deposition of low surface energy solid films and self-assembled monolayers.
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World Tribology Congress III
September 12–16, 2005
Washington, D.C., USA
Conference Sponsors:
- Tribology Division
ISBN:
0-7918-4202-9
PROCEEDINGS PAPER
Surface Adhesion and Friction in Microelectromechanical Systems: Measurement and Modification Techniques
K. Komvopoulos
K. Komvopoulos
University of California at Berkeley, Berkeley, CA
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K. Komvopoulos
University of California at Berkeley, Berkeley, CA
Paper No:
WTC2005-64107, pp. 831-832; 2 pages
Published Online:
November 17, 2008
Citation
Komvopoulos, K. "Surface Adhesion and Friction in Microelectromechanical Systems: Measurement and Modification Techniques." Proceedings of the World Tribology Congress III. World Tribology Congress III, Volume 2. Washington, D.C., USA. September 12–16, 2005. pp. 831-832. ASME. https://doi.org/10.1115/WTC2005-64107
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