A novel quantitative nano+micro-tribometer with integrated nanoindenter, SPM and optical microscope imaging has been used to characterize mechanical properties of Cu coated Si wafers at various test stages. A 2D Finite Element Model was developed to study changes on workhardened contacts assessed via nanoindentation experiments.
Tribological Process Characterization With In-Situ Quantitative Nano-Scale Metrology
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Daugela, A, Meyman, A, Knyazik, V, & Yeremin, N. "Tribological Process Characterization With In-Situ Quantitative Nano-Scale Metrology." Proceedings of the World Tribology Congress III. World Tribology Congress III, Volume 2. Washington, D.C., USA. September 12–16, 2005. pp. 803-804. ASME. https://doi.org/10.1115/WTC2005-63834
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