A novel quantitative nano+micro-tribometer with integrated nanoindenter, SPM and optical microscope imaging has been used to characterize mechanical properties of Cu coated Si wafers at various test stages. A 2D Finite Element Model was developed to study changes on workhardened contacts assessed via nanoindentation experiments.

Volume Subject Area:
Micro- and Nanotribology
Topics:
Finite element model, Imaging, Mechanical properties, Metrology, Nanoindentation, Nanoscale phenomena, Optical microscopes, Scanning probe microscopy, Semiconductor wafers, Tribology, Tribometers
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