A Study on Adhesion Between Mold and Resist in Nanoimprint Lithography

Nanoimprint lithography (NIL) is one of the promising technologies to fabricate integrated fine patterns due to high-throughput and large processing latitude at low cost. However, adhesion between the mold and the resist occurs inevitably in NIL because the mold physically contacts with the resist. The adhesive force and friction force acting on the interface between the mold and the resist can cause the distortion and fracture of the mold and the patterns transferred on the resist when the mold is separated from the resist after imprinting process. In this study, the adhesion properties between quartz mold and mr-I PMMA and mr-I 7020 as resist usually used in thermal NIL is investigated. As the results of the comparison of the adhesion properties of two resists, it is found that mr-I PMMA has good release characteristics.