Fluorocarbon films, which can be used to minimize stiction of silicon microstructures, have been deposited by passivation process in deep reactive ion etching tool. The wettability, surface energy, nano-scale adhesive force, and thermal stability have been investigated by contact angle measuring system, atomic force microscopy (AFM) and ellipsometry. The fluorocarbon films are good for anti-stiction applications due to their high water contact angle (110°), low surface energy (14.5mJ/m2), low nano-scale adhesive force (33 nN) and high thermal stability up to 300°C.

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