The forces of interaction between ceria slurry particles, and polyurethane CMP polishing pads were measured by atomic force microscopy. To measure the forces between the ceria particles and the pads with the AFM, we attached the ceria particles to the AFM tip with epoxy. Attachment of large balls to the AFM tip has been reported before, as well as functionalizing the tip surface with various molecules. Here we report the first successful attachment of nanosize (∼50–100nm) particles to the AFM tip and the direct measurements of forces using such tips. Specifically, we report study of adhesion and long-range force between nanosize ceria particles and three different polyurethane polishing pads. The forces were measured in aqueous solutions of different pH’s ranging from 4 to 9.
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World Tribology Congress III
September 12–16, 2005
Washington, D.C., USA
Conference Sponsors:
- Tribology Division
ISBN:
0-7918-4202-9
PROCEEDINGS PAPER
On Direct Measurement of Forces Between CMP Polishing Pads and Abrasive Nanoparticles
N. Chechik,
N. Chechik
Rohm & Haas Electronic Materials, Newark, DE
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D. James
D. James
Rohm & Haas Electronic Materials, Newark, DE
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I. Sokolov
Clarkson University, Potsdam, NY
Q. K. Ong
Clarkson University, Potsdam, NY
N. Chechik
Rohm & Haas Electronic Materials, Newark, DE
D. James
Rohm & Haas Electronic Materials, Newark, DE
Paper No:
WTC2005-64160, pp. 503-504; 2 pages
Published Online:
November 17, 2008
Citation
Sokolov, I, Ong, QK, Chechik, N, & James, D. "On Direct Measurement of Forces Between CMP Polishing Pads and Abrasive Nanoparticles." Proceedings of the World Tribology Congress III. World Tribology Congress III, Volume 2. Washington, D.C., USA. September 12–16, 2005. pp. 503-504. ASME. https://doi.org/10.1115/WTC2005-64160
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