Three elements of work are described: (i) a contact mechanics model of the polishing pad, used to predict asperity pressures, (ii) micro-tribometer tests on wafers coated with low-k material and (iii) CMP tests on wafer samples. Delamination of low-k samples is observed at higher pressures in both the micro-tribometer and CMP tests. The correlation between the two tests confirms the usefulness of this combined approach to developing process maps of CMP.

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