Beveling or contouring is an important step in the processing of quartz crystal wafers used in resonators. This paper presents a combined analytical and empirical approach for contouring process modeling. Based on the bevel profile measurement the material removal mechanism is analyzed and new characteristics describing the beveling process are introduced. A process model is developed to determine the process parameters of beveling. Compared to the traditional trial-and-error approach, this approach provides a powerful tool for developing beveling methods for new crystal wafer design and beveling process optimization.

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