Beveling or contouring is an important step in the processing of quartz crystal wafers used in resonators. This paper presents a combined analytical and empirical approach for contouring process modeling. Based on the bevel profile measurement the material removal mechanism is analyzed and new characteristics describing the beveling process are introduced. A process model is developed to determine the process parameters of beveling. Compared to the traditional trial-and-error approach, this approach provides a powerful tool for developing beveling methods for new crystal wafer design and beveling process optimization.
Development of a Combined Analytical and Empirical Model for Beveling of Quartz Crystal Wafers
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Dong, C(. "Development of a Combined Analytical and Empirical Model for Beveling of Quartz Crystal Wafers." Proceedings of the World Tribology Congress III. World Tribology Congress III, Volume 1. Washington, D.C., USA. September 12–16, 2005. pp. 841-842. ASME. https://doi.org/10.1115/WTC2005-64254
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