Similar to the semiconductor sector improving processing power by decreasing device sizes, the information storage sector has been working to decrease device sizes in read/write heads. Chemical mechanical polishing (CMP) is a critical enabling technology for terabyte storage systems and other systems consisting of nanotechnology. A commercial CMP polisher was used, and the experimental material removal rates (MRR) are presented. Since the MRR is a function of the load, relative speed, and film hardness, a nano-indention technique was employed to characterize mechanical properties of the permalloy (NiFe) films. A basic MRR model was developed to compare to the experimental results.

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