RF MEMS switch lifetimes are limited by stiction of the moving components and degradation of the metal to metal contact points during cycling. Currently, maximum switch lifetimes are around 10 to 25 billion cycles. Past experimentation has shown that some stiction problems can be overcome by carefully controlling the operating parameters, but problems at the contact points remain [1]. It is believed that by developing a set of tribological design rules which limit the factors leading to catastrophic failure, switches can operate in excess of 100 billion cycles. Recent research has quantified the reliability and durability of gold contact points on RF MEMS switches as a function of current [2]. Most experimentation on RF MEMS switches has focused on controlling the operating parameters such as current, voltage, electrode materials, contact area, switching mode and force; however, limited work has been performed on a single device type in multiple environmentally controlled testing conditions such as vacuum, cryogenic temperatures, etc. This presentation will discuss performance of the wiSpry RF MEMS switch focusing on quantification of device reliability and failure mechanisms under various atmospheric and temperature conditions. Environmental testing conditions include switching in open air, vacuum and inert gasses, in temperatures ranging from 294 K to 4 K.
Skip Nav Destination
World Tribology Congress III
September 12–16, 2005
Washington, D.C., USA
Conference Sponsors:
- Tribology Division
ISBN:
0-7918-4201-0
PROCEEDINGS PAPER
Analysis of Cycle Lifetimes and Failure Modes for RF MEMS Switches
Chris Brown,
Chris Brown
North Carolina State University, Raleigh, NC
Search for other works by this author on:
Jacqueline Krim,
Jacqueline Krim
North Carolina State University, Raleigh, NC
Search for other works by this author on:
Art Morris
Art Morris
wiSpry, Inc., Cary, NC
Search for other works by this author on:
Chris Brown
North Carolina State University, Raleigh, NC
Jacqueline Krim
North Carolina State University, Raleigh, NC
Art Morris
wiSpry, Inc., Cary, NC
Paper No:
WTC2005-63733, pp. 343-344; 2 pages
Published Online:
November 17, 2008
Citation
Brown, C, Krim, J, & Morris, A. "Analysis of Cycle Lifetimes and Failure Modes for RF MEMS Switches." Proceedings of the World Tribology Congress III. World Tribology Congress III, Volume 1. Washington, D.C., USA. September 12–16, 2005. pp. 343-344. ASME. https://doi.org/10.1115/WTC2005-63733
Download citation file:
6
Views
Related Proceedings Papers
Related Articles
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review
J. Electron. Packag (June,2023)
Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture
J. Electron. Packag (September,2015)
Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
J. Electron. Packag (March,2018)
Related Chapters
Defect Rate Analysis & Reduction of MPSOC Through Run Time Reconfigurable Computing with Multiple Caches
International Conference on Computer Technology and Development, 3rd (ICCTD 2011)
Reliability-Based Inspection Intervals of Offshore Jacket Fleets
Ageing and Life Extension of Offshore Facilities
Reliability of Electronic Packaging
Essentials of Electronic Packaging: A Multidisciplinary Approach