The notorious coupling of adhesion and residual membrane stress on the bridge of a MEMS-RF-switch and its effects on stiction failure are investigated. The previous model  of a thin flexible circular membrane with zero stiffness is here extended to thick stiff plate under bending. The mechanics of a film delaminating from a substrate is rigorously constructed based on an energy balance.
The Influence of Residual Stress on Micromachine Stiction of a Stiff Circular Plate
Wong, M, Wan, K, & Kogut, L. "The Influence of Residual Stress on Micromachine Stiction of a Stiff Circular Plate." Proceedings of the World Tribology Congress III. World Tribology Congress III, Volume 1. Washington, D.C., USA. September 12–16, 2005. pp. 247-248. ASME. https://doi.org/10.1115/WTC2005-63280
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