Liquid metal (LM) alloys such as eutectic gallium indium (EGaIn) and gallium-indium-tin (Galinstan) have been used in the fabrication of soft and stretchable electronics during the past several years. The liquid-phase and high electrical conductivity of these materials make them one of the best candidates for fabrication of deformable electronics and multifunctional material systems. While liquid metals are highly reliable for fabrication of simple circuits and stretchable microfluidic devices, their application for producing complex circuits faces fabrication challenges due to their high surface tension and surface oxidization. In this study, we propose a scalable, cost-effective, and versatile technique to print complex circuits using silver nanoparticles and transform them into stretchable electronics by incorporating eutectic gallium indium alloys to the circuit. As a result, the deposited liquid metal considerably increases the electrical conductivity and stretchability of the fabricated electronics. The reliability and performance of these stretchable conductors are demonstrated by studying their electromechanical behavior and integrating them into skin-like electronics, termed electronic tattoos.
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ASME 2018 Conference on Smart Materials, Adaptive Structures and Intelligent Systems
September 10–12, 2018
San Antonio, Texas, USA
Conference Sponsors:
- Aerospace Division
ISBN:
978-0-7918-5195-1
PROCEEDINGS PAPER
Fabrication of Soft and Stretchable Electronics Through Integration of Printed Silver Nanoparticles and Liquid Metal Alloy
Mahmoud Tavakoli,
Mahmoud Tavakoli
University of Coimbra, Coimbra, Portugal
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Mohammad H. Malakooti,
Mohammad H. Malakooti
Carnegie Mellon University, Pittsburgh, PA
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Hugo Paisana,
Hugo Paisana
University of Coimbra, Coimbra, Portugal
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Yunsik Ohm,
Yunsik Ohm
Carnegie Mellon University, Pittsburgh, PA
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Daniel Green Marques,
Daniel Green Marques
University of Coimbra, Coimbra, Portugal
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Pedro Alhais Lopes,
Pedro Alhais Lopes
University of Coimbra, Coimbra, Portugal
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Ana P. Piedade,
Ana P. Piedade
University of Coimbra, Coimbra, Portugal
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Anibal T. de Almeida,
Anibal T. de Almeida
University of Coimbra, Coimbra, Portugal
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Carmel Majidi
Carmel Majidi
Carnegie Mellon University, Pittsburgh, PA
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Mahmoud Tavakoli
University of Coimbra, Coimbra, Portugal
Mohammad H. Malakooti
Carnegie Mellon University, Pittsburgh, PA
Hugo Paisana
University of Coimbra, Coimbra, Portugal
Yunsik Ohm
Carnegie Mellon University, Pittsburgh, PA
Daniel Green Marques
University of Coimbra, Coimbra, Portugal
Pedro Alhais Lopes
University of Coimbra, Coimbra, Portugal
Ana P. Piedade
University of Coimbra, Coimbra, Portugal
Anibal T. de Almeida
University of Coimbra, Coimbra, Portugal
Carmel Majidi
Carnegie Mellon University, Pittsburgh, PA
Paper No:
SMASIS2018-8007, V002T08A006; 5 pages
Published Online:
November 14, 2018
Citation
Tavakoli, M, Malakooti, MH, Paisana, H, Ohm, Y, Marques, DG, Lopes, PA, Piedade, AP, de Almeida, AT, & Majidi, C. "Fabrication of Soft and Stretchable Electronics Through Integration of Printed Silver Nanoparticles and Liquid Metal Alloy." Proceedings of the ASME 2018 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. Volume 2: Mechanics and Behavior of Active Materials; Structural Health Monitoring; Bioinspired Smart Materials and Systems; Energy Harvesting; Emerging Technologies. San Antonio, Texas, USA. September 10–12, 2018. V002T08A006. ASME. https://doi.org/10.1115/SMASIS2018-8007
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