Dielectric electroactive polymers are materials capable of mechanically adjusting their volume in response to an electrical stimulus. However, currently these materials require multi-step manufacturing processes which are not additive. This paper presents a novel 3D printed flexible dielectric material and characterizes its use as a dielectric electroactive polymer (DEAP) actuator. The 3D printed material was characterized electrically and mechanically and its functionality as a dielectric electroactive polymer actuator was demonstrated. The flexible 3-D printed material demonstrated a high dielectric constant and ideal stress-strain performance in tensile testing making the 3-D printed material ideal for use as a DEAP actuator. The tensile stress-strain properties were measured on samples printed under three different conditions (three printing angles 0°, 45° and 90°). The results demonstrated the flexible material presents different responses depending on the printing angle. Based on these results, it was possible to determine that the active structure needs low pre-strain to perform a visible contractive displacement when voltage is applied to the electrodes. The actuator produced an area expansion of 5.48% in response to a 4.3 kV applied voltage, with an initial pre-strain of 63.21% applied to the dielectric material.
Skip Nav Destination
ASME 2018 Conference on Smart Materials, Adaptive Structures and Intelligent Systems
September 10–12, 2018
San Antonio, Texas, USA
Conference Sponsors:
- Aerospace Division
ISBN:
978-0-7918-5195-1
PROCEEDINGS PAPER
3-D Printing of Dielectric Electroactive Polymer Actuators and Characterization of Dielectric Flexible Materials
David Gonzalez,
David Gonzalez
Purdue University, West Lafayette, IN
Search for other works by this author on:
Brittany Newell,
Brittany Newell
Purdue University, West Lafayette, IN
Search for other works by this author on:
Jose Garcia,
Jose Garcia
Purdue University, West Lafayette, IN
Search for other works by this author on:
Lucas Noble,
Lucas Noble
Purdue University, West Lafayette, IN
Search for other works by this author on:
Trevor Mamer
Trevor Mamer
Purdue University, West Lafayette, IN
Search for other works by this author on:
David Gonzalez
Purdue University, West Lafayette, IN
Brittany Newell
Purdue University, West Lafayette, IN
Jose Garcia
Purdue University, West Lafayette, IN
Lucas Noble
Purdue University, West Lafayette, IN
Trevor Mamer
Purdue University, West Lafayette, IN
Paper No:
SMASIS2018-8011, V002T02A006; 6 pages
Published Online:
November 14, 2018
Citation
Gonzalez, D, Newell, B, Garcia, J, Noble, L, & Mamer, T. "3-D Printing of Dielectric Electroactive Polymer Actuators and Characterization of Dielectric Flexible Materials." Proceedings of the ASME 2018 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. Volume 2: Mechanics and Behavior of Active Materials; Structural Health Monitoring; Bioinspired Smart Materials and Systems; Energy Harvesting; Emerging Technologies. San Antonio, Texas, USA. September 10–12, 2018. V002T02A006. ASME. https://doi.org/10.1115/SMASIS2018-8011
Download citation file:
63
Views
Related Proceedings Papers
Flexible 3-D Printed Circuits and Sensors
SMASIS2018
Related Articles
Three-Dimensional Printing of Highly Conducting PEDOT: PSS-Based Polymers
J. Manuf. Sci. Eng (January,2023)
Electrostatic Forces
and Stored Energy for Deformable Dielectric
Materials
J. Appl. Mech (July,2005)
A Systematic Approach for Designing Multifunctional Thermally Conducting Polymer Structures With Embedded Actuators
J. Mech. Des (November,2009)
Related Chapters
Part 2, Section II—Materials and Specifications
Companion Guide to the ASME Boiler & Pressure Vessel Code, Volume 1, Second Edition
Part 2, Section II—Materials and Specifications
Companion Guide to the ASME Boiler and Pressure Vessel Code, Volume 1, Third Edition
Hot Melt Ink Printing with Focus on Customized Protective Layers for Metal and Silicon Structuring and Sacrificial Molds for Die Fabrication
International Conference on Instrumentation, Measurement, Circuits and Systems (ICIMCS 2011)