This paper describes new active composite structures based on thermoplastic matrices which contain material homogeneous embedded piezoceramic modules. Starting point is the development of novel thermoplastic compatible piezoceramic modules, so called TPMs. By the utilization of the same matrix material for the composite structure and for the TPM carrier films, these modules afford an opportunity to become directly embedded into the component during its manufacturing process. In this context, the manufacturing technology of the TPMs and of the active composite structure is presented. Furthermore, selected test samples are investigated concerning their modal behavior. Based on the determined characteristics a linear two-port model is used for the reproduction of the experimental results.

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