The goal of this research is to develop a framework for replacing conventional heating and cooling systems with distributed, continuously and electrically controlled, building-integrated thermoelectric (BITE) heat pumps. The coefficient of performance of thermoelectric heat pumps increases as the temperature difference across them decreases and as the amplitude of temperature oscillations decreases. As a result, this research examines how thermal insulation and mass elements can be integrated with thermoelectrics as part of active multi-layer structures in order to minimize net energy consumption. In order to develop BITE systems, an explicit finite volume model was developed to model the dynamic thermal response of active multi-layer wall structures subjected to arbitrary boundary conditions (interior and exterior temperatures and interior heat loads) and control algorithms. Using this numerical model, the effects of wall construction on net system performance were examined. These simulation results provide direction for the ongoing development of BITE systems.
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ASME 2011 Conference on Smart Materials, Adaptive Structures and Intelligent Systems
September 18–21, 2011
Scottsdale, Arizona, USA
Conference Sponsors:
- Aerospace Division
ISBN:
978-0-7918-5471-6
PROCEEDINGS PAPER
Modeling and Design of Building-Integrated Thermoelectrics Available to Purchase
Leon M. Headings,
Leon M. Headings
The Ohio State University, Columbus, OH
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Gregory N. Washington
Gregory N. Washington
The Ohio State University, Columbus, OH
Search for other works by this author on:
Leon M. Headings
The Ohio State University, Columbus, OH
Gregory N. Washington
The Ohio State University, Columbus, OH
Paper No:
SMASIS2011-5214, pp. 767-776; 10 pages
Published Online:
February 7, 2012
Citation
Headings, LM, & Washington, GN. "Modeling and Design of Building-Integrated Thermoelectrics." Proceedings of the ASME 2011 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. ASME 2011 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, Volume 1. Scottsdale, Arizona, USA. September 18–21, 2011. pp. 767-776. ASME. https://doi.org/10.1115/SMASIS2011-5214
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