Purpose –To establish printed circuit board (PCB) solder fracture risk with and without a potting compound present. Design/methodology/approach – Non-linear material properties were established for FEA of interacting sensor components in two sensor configurations under thermal and dynamic loading. Findings – Solder joints showed a clear tendency to be the most-likely-to-fail part of the sensor under the given design conditions in both load cases both with and without potting. Originality/value – Calculations indicate the specific contribution that potting had to stress under each type of load and the relative risk of failure for the sensor components based on component tensile strength.
- Aerospace Division
FEA of Fuel Sensors: Effect of Dynamics and Temperature on Solder Joints
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Delaire, JG, & Ivens, KM. "FEA of Fuel Sensors: Effect of Dynamics and Temperature on Solder Joints." Proceedings of the ASME 2010 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. ASME 2010 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, Volume 1. Philadelphia, Pennsylvania, USA. September 28–October 1, 2010. pp. 605-610. ASME. https://doi.org/10.1115/SMASIS2010-3815
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