Purpose –To establish printed circuit board (PCB) solder fracture risk with and without a potting compound present. Design/methodology/approach – Non-linear material properties were established for FEA of interacting sensor components in two sensor configurations under thermal and dynamic loading. Findings – Solder joints showed a clear tendency to be the most-likely-to-fail part of the sensor under the given design conditions in both load cases both with and without potting. Originality/value – Calculations indicate the specific contribution that potting had to stress under each type of load and the relative risk of failure for the sensor components based on component tensile strength.

This content is only available via PDF.
You do not currently have access to this content.