Deformation Modelling: Embedding a Communication Device in a Polymeric Composite Material

In this paper, an attempt is made to extend the deformation model of a communication device embedded in a viscoelastic thermoset composite polymer commonly known as Sheet Moulding Compound (SMC). The original model takes into account time dependent heat transfer from the mould surface into the SMC charge and the consequent time dependent viscosity propagation during the initial stage of the mould closing and subsequent filling. The required model parameters for viscosity and elasticity have been determined from rheological testing. The extended model will examine the effects of a number of process parameters such as mould closing speed, mould temperature and initial charge temperature. The effect of these parameters on the deformation of the communication device is discussed and is compared to experimental findings.