The shakedown response of conditioned shape memory alloy wires (Flexinol®) is examined experimentally during constant tension thermal cycles, at several load levels. Strain, temperature, and electrical resistivity are measured simultaneously using a specialized experimental setup that enables a relatively rapid temperature rate (1 °C/s) while preserving the temperature uniformity along the gauge length to less than 1.5 °C. Both elongation and electrical resistance are measured from the same local gauge length, allowing strain-corrected electrical resistivity to be inferred. The most repeatable behavior (least shakedown) occurs at the intermediate load of 191 MPa (consistent with the supplier’s maximum stress recommendation), with a small amount of shakedown (and some loss of two-way shape memory) at lower loads and progressively larger shakedown (strain ratcheting and reduction in hysteresis) at higher loads.
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ASME 2009 Conference on Smart Materials, Adaptive Structures and Intelligent Systems
September 21–23, 2009
Oxnard, California, USA
Conference Sponsors:
- Aerospace Division
ISBN:
978-0-7918-4896-8
PROCEEDINGS PAPER
Thermo-Electro-Mechanical Shakedown Response of Conditioned Shape Memory Alloy Wires Available to Purchase
Christopher B. Churchill,
Christopher B. Churchill
University of Michigan, Ann Arbor, MI
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John A. Shaw
John A. Shaw
University of Michigan, Ann Arbor, MI
Search for other works by this author on:
Christopher B. Churchill
University of Michigan, Ann Arbor, MI
John A. Shaw
University of Michigan, Ann Arbor, MI
Paper No:
SMASIS2009-1306, pp. 137-148; 12 pages
Published Online:
February 16, 2010
Citation
Churchill, CB, & Shaw, JA. "Thermo-Electro-Mechanical Shakedown Response of Conditioned Shape Memory Alloy Wires." Proceedings of the ASME 2009 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. Volume 1: Active Materials, Mechanics and Behavior; Modeling, Simulation and Control. Oxnard, California, USA. September 21–23, 2009. pp. 137-148. ASME. https://doi.org/10.1115/SMASIS2009-1306
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