Total hip replacements restore pain-free mobility to approximately 200,000 patients in the U.S. each year [1]. A typical hip system comprises a metal alloy stem, a femoral head (ceramic or metal alloy), and a polyethylene acetabular cup fit into a metal alloy backing. A modular press-fit Morse taper is commonly used to attach the femoral head to the stem. There are also more recent designs that incorporate a second interface at the neck-stem junction (Figure 1). Increased modularity in total hip replacement design allows the surgeon to intraoperatively preserve patient anatomy such as leg length and femoral anteversion and better balance the surrounding soft tissue for optimal biomechanics. However, modularity also increases the number of mechanical junctions and interfaces in the device which may lead to complications such as corrosion, wear, and fracture.
Skip Nav Destination
ASME 2009 Summer Bioengineering Conference
June 17–21, 2009
Lake Tahoe, California, USA
Conference Sponsors:
- Bioengineering Division
ISBN:
978-0-7918-4891-3
PROCEEDINGS PAPER
Double-Modular Hip Device Design Susceptible to Stress Corrosion Failure
Sara A. Atwood,
Sara A. Atwood
University of California at Berkeley, Berkeley, CA
Search for other works by this author on:
Eli W. Patten,
Eli W. Patten
University of California at Berkeley, Berkeley, CA
Search for other works by this author on:
Kevin J. Bozic,
Kevin J. Bozic
University of California at San Francisco, San Francisco, CA
Search for other works by this author on:
Lisa A. Pruitt,
Lisa A. Pruitt
University of California at Berkeley, Berkeley, CA
Search for other works by this author on:
Michael D. Ries
Michael D. Ries
University of California at San Francisco, San Francisco, CA
Search for other works by this author on:
Sara A. Atwood
University of California at Berkeley, Berkeley, CA
Eli W. Patten
University of California at Berkeley, Berkeley, CA
Kevin J. Bozic
University of California at San Francisco, San Francisco, CA
Lisa A. Pruitt
University of California at Berkeley, Berkeley, CA
Michael D. Ries
University of California at San Francisco, San Francisco, CA
Paper No:
SBC2009-204734, pp. 873-874; 2 pages
Published Online:
July 19, 2013
Citation
Atwood, SA, Patten, EW, Bozic, KJ, Pruitt, LA, & Ries, MD. "Double-Modular Hip Device Design Susceptible to Stress Corrosion Failure." Proceedings of the ASME 2009 Summer Bioengineering Conference. ASME 2009 Summer Bioengineering Conference, Parts A and B. Lake Tahoe, California, USA. June 17–21, 2009. pp. 873-874. ASME. https://doi.org/10.1115/SBC2009-204734
Download citation file:
4
Views
0
Citations
Related Proceedings Papers
Related Articles
Observations on the Interaction of High Mean Stress and Type II Hot Corrosion on the Fatigue Behavior of a Nickel Base Superalloy
J. Eng. Gas Turbines Power (January,1985)
Material Influence on Mitigation of Stress Corrosion Cracking Via Laser Shock Peening
J. Manuf. Sci. Eng (January,2017)
A Review on Corrosion and Wear of Additively Manufactured Alloys
J. Tribol (May,2021)
Related Chapters
Surface Analysis and Tools
Tribology of Mechanical Systems: A Guide to Present and Future Technologies
Direct Assessment: Process, Technologies and Modeling
Pipeline Integrity Management Systems: A Practical Approach
Introduction and Definitions
Handbook on Stiffness & Damping in Mechanical Design