This paper discusses the temperature effects of using piezoelectric wafer active sensors (PWAS) technologies for structural health monitoring (SHM) in pressure vessels and piping (PVP) applications, e.g. dry cast storage system (DCSS). The research into monitoring of DCSS health has experienced a dramatic increase following the issuance of the Blue Ribbon Commission (BRC) on America’s Nuclear Future Final Report in 2012. The interim storage of spent nuclear fuel from reactor sites has gained additional importance and urgency for resolving waste-management-related technical issues. PWAS have emerged as one of the major SHM technologies developed particularly for generating and receiving acousto-ultrasonic waves for the purpose of continuous monitoring and diagnosis. Durability and survivability of PWAS under temperature effects was first tested in experiments. The analytical model of PWAS based sensor and sensing system under temperature effects was then developed. This paper compared the analytical model and experimental results of PWAS under temperature changes. Since the environmental variability of a sensing system includes changes in both the sensors and the sensing methodology including acoustic emission (AE), guided ultrasonic waves (GUW), and electro-mechanical impedance spectroscopy (EMIS), we also performed several temperature exposure with different PWAS sensing configurations under a controlled oven. The potential of PWAS for DCSS applications has been explored. The paper ends with conclusions and suggestions for further work.
Temperature Effects on Piezoelectric Wafer Active Sensors
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Ma, L, Sun, X, Lin, B, & Yu, L. "Temperature Effects on Piezoelectric Wafer Active Sensors." Proceedings of the ASME 2015 Pressure Vessels and Piping Conference. Volume 6A: Materials and Fabrication. Boston, Massachusetts, USA. July 19–23, 2015. V06AT06A007. ASME. https://doi.org/10.1115/PVP2015-45841
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