This study was performed to clarify the dependence of ceramic-to-metal joint bonding strength on the interface wedge angle on the ceramic side. Plate Si3N4-to-Ni joints with a plane interface were produced by electric discharge machining. The geometric interface shape at the edge of the interface is characterized by wedge angle on both sides of the ceramic and metal defined as a configuration angle between the free surface of each material and the interface. As the wedge angle of Ni is a right angle, the wedge angle of Si3N4 is set from 30° to 180°. Joints were bonded at high temperature using thin braze metal under vacuum and cooled slowly. The tensile bonding strength of the ceramic-to-metal joint was evaluated to determine the optimum interface shape. The highest bonding strength appeared under identical interface conditions where the fracture pattern changed. The optimum wedge angle to obtain the greatest bonding strength appears to depend on bonding temperature. This study provided a useful geometric interface shape to improve the tensile bonding strength of ceramic-to-metal joints.

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