Comprehensive thermal solution procedures (CTSP) are developed to predict temperature history during laser forming process. The CTSP can provide not only fast and accurate results, but also many useful features, such as convection boundary conditions and distributed water cooling schemes. By means of interface through the virtual fabrication technology (VFT®) software, the CTSP gives direct temperature results for FEA stress/distortion analysis.
- Pressure Vessels and Piping Division
Comprehensive Thermal Solution Procedures for Laser Forming
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Cao, Z, Yang, Z, & Yang, Y. "Comprehensive Thermal Solution Procedures for Laser Forming." Proceedings of the ASME/JSME 2004 Pressure Vessels and Piping Conference. Residual Stress, Fracture, and Stress Corrosion Cracking. San Diego, California, USA. July 25–29, 2004. pp. 19-24. ASME. https://doi.org/10.1115/PVP2004-2644
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