Materials used in high-pressure vessels may be subjected to rapid temperature change, which may induce micro-cracks on the surface and into material. The growth of micro-cracks is detrimental to facility life. Chromium carbide (Cr3C2) has been proved to be a potential structural material for toughening alumina in biomedical and industrial applications because of its high Young’s modulus and erosion resistance. On the other hand, TiC/Al2O3 composite has been used as a magnetic head slider due to its good wear resistance and mechanical strength, and potentially could be an excellent lining material. In this study we thermally shocked ceramic material in disc shape to create different degrees of micro-cracking and use ultrasound attenuation technique to evaluate the damage. This includes narrow band tone burst at different frequency. The results showed significant dependence between ultrasonic attenuation and shock temperature. Corresponding SEM pictures show although the size of micro-crack doesn’t change, the depth of the micro-cracks increases. It is demonstrated that ultrasonic attenuation proves to be a reliable tool for evaluating micro-fractures in solids.
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ASME 2003 Pressure Vessels and Piping Conference
July 20–24, 2003
Cleveland, Ohio, USA
Conference Sponsors:
- Pressure Vessels and Piping Division
ISBN:
0-7918-4151-0
PROCEEDINGS PAPER
Ultrasonic Evaluation of Ceramics With Micro-Cracks
Shih-Jeh Wu,
Shih-Jeh Wu
I-Shou University, Kaohsiung, Taiwan
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Ching-An Jeng,
Ching-An Jeng
I-Shou University, Kaohsiung, Taiwan
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Chen-Ming Kuo
Chen-Ming Kuo
I-Shou University, Kaohsiung, Taiwan
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Shih-Jeh Wu
I-Shou University, Kaohsiung, Taiwan
Ching-An Jeng
I-Shou University, Kaohsiung, Taiwan
Chen-Ming Kuo
I-Shou University, Kaohsiung, Taiwan
Paper No:
PVP2003-1961, pp. 167-169; 3 pages
Published Online:
August 13, 2008
Citation
Wu, S, Jeng, C, & Kuo, C. "Ultrasonic Evaluation of Ceramics With Micro-Cracks." Proceedings of the ASME 2003 Pressure Vessels and Piping Conference. Emerging Technology in Fluids, Structures, and Fluid Structure Interactions. Cleveland, Ohio, USA. July 20–24, 2003. pp. 167-169. ASME. https://doi.org/10.1115/PVP2003-1961
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