Interface cracks are seldom subjected to pure Mode I or pure Mode II conditions. Stationary interface cracks between two distinct, bonded elastic-creep materials subjected to remotely applied mixed mode loading are simulated. The finite element method (FEM) is used to examine crack tip fields and candidate driving force parameters for crack growth. Plane strain conditions are assumed. In most cases a functionally graded transition layer is included between the two materials. Examples of such systems include weld metal (WM) and base metal (BM) interfaces in welded or repaired boiler components subjected to elevated temperatures. Numerical solutions based on the asymptotic fields of the homogeneous and heterogeneous Arcan-type specimens are presented. Creep ductility-based damage models are used to predict the initial crack propagation trajectory. The incorporation of functionally graded transition layer regions affects the evolution of time-dependent stress components in the vicinity of the crack tip. The magnitude and direction of crack tip propagation can then be optimized with respect to interface properties.
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ASME 2003 Pressure Vessels and Piping Conference
July 20–24, 2003
Cleveland, Ohio, USA
Conference Sponsors:
- Pressure Vessels and Piping Division
ISBN:
0-7918-4151-0
PROCEEDINGS PAPER
Mixed Mode Loading of an Interface Crack Subjected to Creep Conditions Available to Purchase
Ali P. Gordon,
Ali P. Gordon
Georgia Institute of Technology, Atlanta, GA
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David L. McDowell
David L. McDowell
Georgia Institute of Technology, Atlanta, GA
Search for other works by this author on:
Ali P. Gordon
Georgia Institute of Technology, Atlanta, GA
David L. McDowell
Georgia Institute of Technology, Atlanta, GA
Paper No:
PVP2003-1958, pp. 145-153; 9 pages
Published Online:
August 13, 2008
Citation
Gordon, AP, & McDowell, DL. "Mixed Mode Loading of an Interface Crack Subjected to Creep Conditions." Proceedings of the ASME 2003 Pressure Vessels and Piping Conference. Emerging Technology in Fluids, Structures, and Fluid Structure Interactions. Cleveland, Ohio, USA. July 20–24, 2003. pp. 145-153. ASME. https://doi.org/10.1115/PVP2003-1958
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