Modeling Acoustic Properties of Different Types of Lightweight T-Junctions

To accurately model the effect on the dynamic behavior of a floor when using glue in the joints between the chipboards and beams in a lightweight structure can be a daunting task. It is however important to have a model that can simulate these junctions with high fidelity. The behavior of T-junctions with different geometries and methods of adhesion has been previously investigated via measurements [1]. This investigation builds on that work and aims at developing an accurate finite element model of the junctions. The previously investigated junctions were made of chipboards fixed to a spruce beam using screws or a combination of screws and glue. The boards were either a single plate or two plates meeting each other on top of the beam. In this investigation different approaches of simulating the junction using the finite element method were tried. The validity of the FE models was evaluated by calibrating them with previous performed measurements in [1]. A parameter study was also performed on the models to investigate the effect of the glue on the overall performance of the structure.