The development of processing methods for flexible electronic devices is seen as an enabling technology for the creation of a new array of semiconductor products. These devices have the potential be low cost, disposable, and can be applied to deformable or non-planar surfaces. While much effort has been put into the development of amorphous silicon and organic semiconductor technology for flexible devices, semiconductor nanomaterials are of interest due to their inherently flexibility, high transport mobilities, and their unique optoelectronic and piezoelectric properties. However, the synthesis of these materials directly onto polymer substrates is not feasible due to the high temperatures or harsh chemical environments under which they are synthesized. This challenge has limited the development of flexible electronics with semiconductor nanomaterial building blocks. A number of techniques which address the manufacturing concerns include solution based processing [1,2] as well as dry transfer techniques [3–5]. In general, dry transfer printing methods carry advantages over solution based processing as the need to address substrate-fluid compatibility is mitigated.
Skip Nav Destination
ASME 4th Integrated Nanosystems Conference
September 12–14, 2005
Berkeley, California, USA
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4208-8
PROCEEDINGS PAPER
Flexible Electronic Devices From Hot Embossing Materials Transfer Available to Purchase
Ashante’ Allen,
Ashante’ Allen
Georgia Institute of Technology, Atlanta, GA
Search for other works by this author on:
Andrew Cannon,
Andrew Cannon
Georgia Institute of Technology, Atlanta, GA
Search for other works by this author on:
William King,
William King
Georgia Institute of Technology, Atlanta, GA
Search for other works by this author on:
Samuel Graham
Samuel Graham
Georgia Institute of Technology, Atlanta, GA
Search for other works by this author on:
Ashante’ Allen
Georgia Institute of Technology, Atlanta, GA
Andrew Cannon
Georgia Institute of Technology, Atlanta, GA
William King
Georgia Institute of Technology, Atlanta, GA
Samuel Graham
Georgia Institute of Technology, Atlanta, GA
Paper No:
NANO2005-87068, pp. 75-76; 2 pages
Published Online:
October 15, 2008
Citation
Allen, A, Cannon, A, King, W, & Graham, S. "Flexible Electronic Devices From Hot Embossing Materials Transfer." Proceedings of the ASME 4th Integrated Nanosystems Conference. Design, Synthesis, and Applications. Berkeley, California, USA. September 12–14, 2005. pp. 75-76. ASME. https://doi.org/10.1115/NANO2005-87068
Download citation file:
8
Views
Related Proceedings Papers
Related Articles
Process Robustness of Hot Embossing Microfluidic Devices
J. Manuf. Sci. Eng (June,2010)
Thermal Transport in Nanostructured Solid-State Cooling Devices
J. Heat Transfer (January,2005)
Large Strain Mechanical Behavior of Poly(methyl methacrylate) (PMMA) Near the Glass Transition Temperature
J. Eng. Mater. Technol (October,2006)
Related Chapters
Hot Melt Ink Printing with Focus on Customized Protective Layers for Metal and Silicon Structuring and Sacrificial Molds for Die Fabrication
International Conference on Instrumentation, Measurement, Circuits and Systems (ICIMCS 2011)
A Multi-Channel Clustered Web Application Server: Architecture
International Conference on Future Computer and Communication, 3rd (ICFCC 2011)
Fabrication of Silicon Carbide Photodiodes with Enhanced High-Temperature Performance by Electrochemical Anodization Technology
International Conference on Computer and Electrical Engineering 4th (ICCEE 2011)