The manufacture of nanoscale devices is at present constrained by the resolution limits of optical lithography and the high cost of electron beam lithography. Furthermore, traditional silicon fabrication techniques are quite limited in materials compatibility and are not well-suited for the manufacture of organic and biological devices. One nanomanufacturing technique that could overcome these drawbacks is dip pen nanolithography (DPN), in which a chemical-coated atomic force microscope (AFM) tip deposits molecular ‘inks’ onto a substrate [1]. DPN has shown resolution as good as 5 nm [2] and has been performed with a large number of molecules, but has limitations. For molecules to ink the surface they must be mobile at room temperature, limiting the inks that can be used, and since the inks must be mobile in ambient conditions, there is no way to stop the deposition while the tip is in contact with the substrate. In-situ imaging of deposited molecules therefore causes contamination of the deposited features.
Skip Nav Destination
ASME 2004 3rd Integrated Nanosystems Conference
September 22–24, 2004
Pasadena, California, USA
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4177-4
PROCEEDINGS PAPER
Transport in Thermal Dip Pen Nanolithography
Brent A. Nelson,
Brent A. Nelson
Georgia Institute of Technology, Atlanta, GA
Search for other works by this author on:
Tanya L. Wright,
Tanya L. Wright
Georgia Institute of Technology, Atlanta, GA
Search for other works by this author on:
William P. King,
William P. King
Georgia Institute of Technology, Atlanta, GA
Search for other works by this author on:
Paul E. Sheehan,
Paul E. Sheehan
Naval Research Laboratory, Washington, D.C.
Search for other works by this author on:
Lloyd J. Whitman
Lloyd J. Whitman
Naval Research Laboratory, Washington, D.C.
Search for other works by this author on:
Brent A. Nelson
Georgia Institute of Technology, Atlanta, GA
Tanya L. Wright
Georgia Institute of Technology, Atlanta, GA
William P. King
Georgia Institute of Technology, Atlanta, GA
Paul E. Sheehan
Naval Research Laboratory, Washington, D.C.
Lloyd J. Whitman
Naval Research Laboratory, Washington, D.C.
Paper No:
NANO2004-46074, pp. 125-126; 2 pages
Published Online:
November 17, 2008
Citation
Nelson, BA, Wright, TL, King, WP, Sheehan, PE, & Whitman, LJ. "Transport in Thermal Dip Pen Nanolithography." Proceedings of the ASME 2004 3rd Integrated Nanosystems Conference. Design, Synthesis, and Applications. Pasadena, California, USA. September 22–24, 2004. pp. 125-126. ASME. https://doi.org/10.1115/NANO2004-46074
Download citation file:
6
Views
Related Proceedings Papers
Related Articles
Characterization of the Dip Pen Nanolithography Process for Nanomanufacturing
J. Manuf. Sci. Eng (August,2011)
Electric-Field-Assisted Contact Mode Atomic Force Microscope-Based Nanolithography With Low Stiffness Conductive Probes
J. Micro Nano-Manuf (March,2022)
Tip-Based Nanomanufacturing of Nanofluidics Using Atomic Force Microscopy
J. Micro Nano-Manuf (December,2016)
Related Chapters
Hot Melt Ink Printing with Focus on Customized Protective Layers for Metal and Silicon Structuring and Sacrificial Molds for Die Fabrication
International Conference on Instrumentation, Measurement, Circuits and Systems (ICIMCS 2011)
Surface Analysis and Tools
Tribology of Mechanical Systems: A Guide to Present and Future Technologies
Artificial Indents as the Root Cause of Rolling Contact Fatigue Damage: Effect of Plastic Properties
Bearing and Transmission Steels Technology