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Proceedings Papers

Understanding Mechanical Response of Porous Polymeric Stamps During Large-Area Metal-Assisted Chemical Imprinting of Silicon

Emmanuel Dasinor, Aliaksandr Sharstniou, Yifu Ding, Bruno Azeredo
Publisher: American Society of Mechanical Engineers
Proc. ASME. MSEC2023, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T08A008, June 12–16, 2023
Paper No: MSEC2023-106561
https://doi.org/10.1115/MSEC2023-106561
View Paper titled, Understanding Mechanical Response of Porous Polymeric Stamps During Large-Area Metal-Assisted Chemical Imprinting of Silicon
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Topics: Metals, Silicon, Finite element analysis, Deflection, Etching, Mechanical behavior, Membranes, Pressure, Computer software, Elasticity
Proceedings Papers

Stroboscopic Data-Driven, Integrated, and Intelligent Machine Learning-Based Algorithms for Semiconductor Wafer Inspection

Changheon Han, Heebum Chun, ChaBum Lee, Martin Byung-Guk Jun
Publisher: American Society of Mechanical Engineers
Proc. ASME. MSEC2023, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T09A003, June 12–16, 2023
Paper No: MSEC2023-101213
https://doi.org/10.1115/MSEC2023-101213
View Paper titled, Stroboscopic Data-Driven, Integrated, and Intelligent Machine Learning-Based Algorithms for Semiconductor Wafer Inspection
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Topics: Algorithms, Computers, Inspection, Intelligent machines, Machine learning, Manufacturing, Semiconductor wafers, Particulate matter, Machinery, Human factors
Proceedings Papers

Global Disruption of Semiconductor Supply Chains During COVID-19: An Evaluation of Leading Causal Factors

Aamirah Mohammed, Sardar Asif Khan
Proc. ASME. MSEC2022, Volume 2: Manufacturing Processes; Manufacturing Systems, V002T06A011, June 27–July 1, 2022
Paper No: MSEC2022-85306
https://doi.org/10.1115/MSEC2022-85306
View Paper titled, Global Disruption of Semiconductor Supply Chains During COVID-19: An Evaluation of Leading Causal Factors
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Topics: Resilience, Semiconductors (Materials), Supply chains
Proceedings Papers

A Novel Quality Clustering Methodology on Fab-Wide Wafer Map Images in Semiconductor Manufacturing

Yuan-Ming Hsu, Xiaodong Jia, Wenzhe Li, Jay Lee
Proc. ASME. MSEC2022, Volume 2: Manufacturing Processes; Manufacturing Systems, V002T06A022, June 27–July 1, 2022
Paper No: MSEC2022-85670
https://doi.org/10.1115/MSEC2022-85670
View Paper titled, A Novel Quality Clustering Methodology on Fab-Wide Wafer Map Images in Semiconductor Manufacturing
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Topics: Integrated circuit fabrication, Semiconductor wafers, Topology, Biomedicine, Manufacturing, Semiconductors (Materials), Visualization
Proceedings Papers

Semiconductor Aspects of the Oxyfuel Cutting Torch Preheat Flame: Part I — Measurements Between Torch and Work

Christopher R. Martin, Teresa Pond, Jacob Tomas, Jenna Schmit, Erikson Miguel, Alex Untaroiu, Kemu Xu
Proc. ASME. MSEC2020, Volume 1: Additive Manufacturing; Advanced Materials Manufacturing; Biomanufacturing; Life Cycle Engineering; Manufacturing Equipment and Automation, V001T05A011, September 3, 2020
Paper No: MSEC2020-8258
https://doi.org/10.1115/MSEC2020-8258
View Paper titled, Semiconductor Aspects of the Oxyfuel Cutting Torch Preheat Flame: Part I — Measurements Between Torch and Work
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Topics: Cutting, Flames, Semiconductors (Materials), Signals, Currents, Ions, Uncertainty
Proceedings Papers

Molecular Dynamics Simulations of Deformation Behavior of AlN in Nanoscratching

Baozhen Li
Proc. ASME. MSEC2020, Volume 1: Additive Manufacturing; Advanced Materials Manufacturing; Biomanufacturing; Life Cycle Engineering; Manufacturing Equipment and Automation, V001T05A002, September 3, 2020
Paper No: MSEC2020-8222
https://doi.org/10.1115/MSEC2020-8222
View Paper titled, Molecular Dynamics Simulations of Deformation Behavior of AlN in Nanoscratching
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Topics: Deformation, Molecular dynamics simulation, Friction, Dislocations, Aluminum, Mechanical properties, Molecular dynamics, Nucleation (Physics), Semiconductors (Materials)
Proceedings Papers

Semiconductor Aspects of the Oxyfuel Cutting Torch Preheat Flame: Part II — The Flame’s Internal Electrical Structure

Christopher R. Martin, Teresa Pond, Jacob Tomas, Jenna Schmit, Erikson Miguel, Alex Untaroiu, Kemu Xu
Proc. ASME. MSEC2020, Volume 1: Additive Manufacturing; Advanced Materials Manufacturing; Biomanufacturing; Life Cycle Engineering; Manufacturing Equipment and Automation, V001T05A012, September 3, 2020
Paper No: MSEC2020-8259
https://doi.org/10.1115/MSEC2020-8259
View Paper titled, Semiconductor Aspects of the Oxyfuel Cutting Torch Preheat Flame: Part II — The Flame’s Internal Electrical Structure
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Topics: Cutting, Flames, Semiconductors (Materials), Wire, Currents, Density, Rotating disks, Cylinders, Flow (Dynamics), Probes
Proceedings Papers

Regional Manufacturing Cost Structures and Supply Chain Considerations for Medium Voltage Silicon Carbide Power Applications

Samantha Reese, Margaret Mann, Timothy Remo, Kelsey Horowitz
Proc. ASME. MSEC2018, Volume 2: Materials; Joint MSEC-NAMRC-Manufacturing USA, V002T07A004, June 18–22, 2018
Paper No: MSEC2018-6601
https://doi.org/10.1115/MSEC2018-6601
View Paper titled, Regional Manufacturing Cost Structures and Supply Chain Considerations for Medium Voltage Silicon Carbide Power Applications
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Topics: Manufacturing, Silicon, Supply chains, Collaboration, Energy gap, Motor drives, Semiconductor wafers, Semiconductors (Materials)
Proceedings Papers

Investigation on Smoothing Silicon Carbide Wafer With a Combined Method of Mechanical Lapping and Photocatalysis Assisted Chemical Mechanical Polishing

Zewei Yuan, Kai Cheng, Yan He, Meng Zhang
Proc. ASME. MSEC2018, Volume 4: Processes, V004T03A002, June 18–22, 2018
Paper No: MSEC2018-6615
https://doi.org/10.1115/MSEC2018-6615
View Paper titled, Investigation on Smoothing Silicon Carbide Wafer With a Combined Method of Mechanical Lapping and Photocatalysis Assisted Chemical Mechanical Polishing
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Topics: Grinding, Polishing, Semiconductor wafers, Silicon, Surface roughness, Crystals, Electron capture, Integrated circuits, Irradiation (Radiation exposure), Optoelectronic devices
Proceedings Papers

Rapid Intense Pulse Light Sintering of Copper Sulphide Nanoparticle Films

Shalu Bansal, Zhongwei Gao, Chih-hung Chang, Rajiv Malhotra
Proc. ASME. MSEC2017, Volume 1: Processes, V001T02A067, June 4–8, 2017
Paper No: MSEC2017-2739
https://doi.org/10.1115/MSEC2017-2739
View Paper titled, Rapid Intense Pulse Light Sintering of Copper Sulphide Nanoparticle Films
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Topics: Copper, Nanoparticles, Sintering, Thin films, Electrical properties, Coatings, Crystal structure, Electronics, Metals, Semiconductors (Materials)
Proceedings Papers

Scalable Manufacturing of Metal Nanoparticles by Thermal Fiber Drawing

Jingzhou Zhao, Abdolreza Javadi, Ting-Chiang Lin, Injoo Hwang, Yingchao Yang, Zeyi Guan, Xiaochun Li
Proc. ASME. MSEC2016, Volume 1: Processing, V001T02A083, June 27–July 1, 2016
Paper No: MSEC2016-8782
https://doi.org/10.1115/MSEC2016-8782
View Paper titled, Scalable Manufacturing of Metal Nanoparticles by Thermal Fiber Drawing
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Topics: Fibers, Manufacturing, Metals, Nanoparticles, Composite materials, Drops, Glass, Nanomanufacturing, Polyethersulfone, Polymers
Proceedings Papers

Direct Electrochemical Imprinting of Sinusoidal Linear Gratings Into Silicon

Bruno Azeredo, Keng Hsu, Placid Ferreira
Proc. ASME. MSEC2016, Volume 1: Processing, V001T02A086, June 27–July 1, 2016
Paper No: MSEC2016-8835
https://doi.org/10.1115/MSEC2016-8835
View Paper titled, Direct Electrochemical Imprinting of Sinusoidal Linear Gratings Into Silicon
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Topics: Diffraction gratings, Silicon, Etching, Chemical etching, Catalysts, Resolution (Optics), Electron beams, Lithography, Nanoscale phenomena, Semiconductors (Materials)
Proceedings Papers

Anisotropy Effect on Cutting Monocrystal Sapphire by Micro-Laser Assisted Machining Technique

Hossein Mohammadi, John A. Patten
Proc. ASME. MSEC2016, Volume 1: Processing, V001T02A018, June 27–July 1, 2016
Paper No: MSEC2016-8652
https://doi.org/10.1115/MSEC2016-8652
View Paper titled, Anisotropy Effect on Cutting Monocrystal Sapphire by Micro-Laser Assisted Machining Technique
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Topics: Anisotropy, Cutting, Lasers, Machining, Sapphire, Brittleness, Damage, Heating, Ceramics, Crystal structure
Proceedings Papers

Investigation on the Effect of Carbon Nanotubes Concentration on the Electrical and Rheological Properties of PP/MWCNTs Composites

Felicia Stan, Laurentiu Sandu, Catalin Fetecau
Proc. ASME. MSEC2015, Volume 1: Processing, V001T02A059, June 8–12, 2015
Paper No: MSEC2015-9411
https://doi.org/10.1115/MSEC2015-9411
View Paper titled, Investigation on the Effect of Carbon Nanotubes Concentration on the Electrical and Rheological Properties of PP/MWCNTs Composites
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Topics: Carbon nanotubes, Composite materials, Multi-walled carbon nanotubes, Rheology, Flow (Dynamics), Electrical conductivity, Nanotubes, Dimensions, Injection molding, Percolation theory
Proceedings Papers

Scratch Tests on Granite Using Micro-Laser Assisted Machining Technique

Hossein Mohammadi, John A. Patten
Proc. ASME. MSEC2015, Volume 1: Processing, V001T02A007, June 8–12, 2015
Paper No: MSEC2015-9327
https://doi.org/10.1115/MSEC2015-9327
View Paper titled, Scratch Tests on Granite Using Micro-Laser Assisted Machining Technique
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Topics: Lasers, Machining, Brittleness, Heating, Ceramics, Cutting, Diamond tools, Fracture (Materials), Fracture (Process), Fracture toughness
Proceedings Papers

Studying the Temperature Effect During the High-Pressure Phase Transformation of Silicon via Indentations

Deepak Ravindra, John Patten, Muralidhar K. Ghantasala
Proc. ASME. MSEC2012, ASME 2012 International Manufacturing Science and Engineering Conference, 521-525, June 4–8, 2012
Paper No: MSEC2012-7323
https://doi.org/10.1115/MSEC2012-7323
View Paper titled, Studying the Temperature Effect During the High-Pressure Phase Transformation of Silicon via Indentations
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Topics: High pressure (Physics), Phase transitions, Silicon, Temperature, Machining, Lasers, Brittleness, Pressure, Ceramics, Cutting tools
Proceedings Papers

Diamond Disc Pad Conditioning in Chemical Mechanical Planarization (CMP): A Mathematical Model to Predict Pad Surface Shape

Z. C. Li, Emmanuel A. Baisie, X. H. Zhang
Proc. ASME. MSEC2011, ASME 2011 International Manufacturing Science and Engineering Conference, Volume 1, 175-184, June 13–17, 2011
Paper No: MSEC2011-50149
https://doi.org/10.1115/MSEC2011-50149
View Paper titled, Diamond Disc Pad Conditioning in Chemical Mechanical Planarization (CMP): A Mathematical Model to Predict Pad Surface Shape
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Topics: Diamonds, Disks, Shapes, Semiconductor wafers, Abrasives, Kinematic analysis, Polishing, Semiconductors (Materials)
Proceedings Papers

Measurement of Tool Internal Temperatures in the Tool-Chip Contact Region by Embedded Thin Film Micro Thermocouples

Dirk Werschmoeller, Xiaochun Li
Proc. ASME. MSEC2010, ASME 2010 International Manufacturing Science and Engineering Conference, Volume 1, 371-377, October 12–15, 2010
Paper No: MSEC2010-34176
https://doi.org/10.1115/MSEC2010-34176
View Paper titled, Measurement of Tool Internal Temperatures in the Tool-Chip Contact Region by Embedded Thin Film Micro Thermocouples
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Topics: Temperature, Thermocouples, Thin films, Machining, Bonding, Cutting, Sensors, Thermomechanics, Boron, Diffusion bonding (Metals)
Proceedings Papers

Experimental Study of Lapping Using Mixed Abrasive Grits

Chunhui Chung, Glenn Melendez, Imin Kao
Proc. ASME. MSEC2009, ASME 2009 International Manufacturing Science and Engineering Conference, Volume 1, 729-736, October 4–7, 2009
Paper No: MSEC2009-84210
https://doi.org/10.1115/MSEC2009-84210
View Paper titled, Experimental Study of Lapping Using Mixed Abrasive Grits
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Topics: Grinding, Semiconductor wafers, Manufacturing, Slurries, Surface roughness, Microelectronic devices, Abrasive machining, Abrasives, Brittleness, Density
Proceedings Papers

A Unified Simple Predictive Model for High Fluence Ultra-Short Pulsed Laser Ablation of Metal, Semiconductor and Dielectric

Benxin Wu, Yung C. Shin
Proc. ASME. MSEC2009, ASME 2009 International Manufacturing Science and Engineering Conference, Volume 1, 853-859, October 4–7, 2009
Paper No: MSEC2009-84317
https://doi.org/10.1115/MSEC2009-84317
View Paper titled, A Unified Simple Predictive Model for High Fluence Ultra-Short Pulsed Laser Ablation of Metal, Semiconductor and Dielectric
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Topics: Fluence (Radiation measurement), Laser ablation, Metals, Semiconductors (Materials)