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Proceedings Papers

A Preliminary Investigation of Input Shaping to Reduce the Residual Vibration of a Wafer-Handling Robot

Yung-Chun Lin, Chen Qian, Shorya Awtar, Chinedum E. Okwudire
Proc. ASME. MSEC2024, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality & Reliability, V002T05A006, June 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2024-125193
https://doi.org/10.1115/MSEC2024-125193
View Paper titled, A Preliminary Investigation of Input Shaping to Reduce the Residual Vibration of a Wafer-Handling Robot
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Topics: Integrated circuit fabrication, Robots, Semiconductor wafers, Vibration
Proceedings Papers

Optimized Deep Convolutional Neural Network for Wafer Map Defects Classification

Zemenu Endalamaw Amogne, Jia-Hong Chou
Proc. ASME. MSEC2024, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality & Reliability, V002T05A003, June 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2024-123370
https://doi.org/10.1115/MSEC2024-123370
View Paper titled, Optimized Deep Convolutional Neural Network for Wafer Map Defects Classification
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Topics: Convolutional neural networks, Pattern recognition, Semiconductor wafers
Proceedings Papers

Model Development of Manufacturing Information System for Silicon Carbide Wafer Production

Olukayode Fatoki, Zhichao Li
Proc. ASME. MSEC2024, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality & Reliability, V002T05A002, June 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2024-121840
https://doi.org/10.1115/MSEC2024-121840
View Paper titled, Model Development of Manufacturing Information System for Silicon Carbide Wafer Production
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Topics: Manufacturing, Model development, Semiconductor wafers, Semiconductors (Materials), Silicon carbide
Proceedings Papers

Particle Inspection by Single Camera-Based 3D Stereoscopy

Hyun Jae Lee, Gugyeong Sung, Heebum Chun, ChaBum Lee
Proc. ASME. MSEC2024, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality & Reliability, V002T05A007, June 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2024-125207
https://doi.org/10.1115/MSEC2024-125207
View Paper titled, Particle Inspection by Single Camera-Based 3D Stereoscopy
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Topics: Inspection, Particulate matter, Semiconductor wafers, Stereoscopy
Proceedings Papers

Understanding Mechanical Response of Porous Polymeric Stamps During Large-Area Metal-Assisted Chemical Imprinting of Silicon

Emmanuel Dasinor, Aliaksandr Sharstniou, Yifu Ding, Bruno Azeredo
Proc. ASME. MSEC2023, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T08A008, June 12–16, 2023
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2023-106561
https://doi.org/10.1115/MSEC2023-106561
View Paper titled, Understanding Mechanical Response of Porous Polymeric Stamps During Large-Area Metal-Assisted Chemical Imprinting of Silicon
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Topics: Metals, Silicon, Finite element analysis, Deflection, Etching, Mechanical behavior, Membranes, Pressure, Computer software, Elasticity
Proceedings Papers

An Experimental Investigation on Nanosecond Laser Ablation of Single Crystalline Silicon Wafers

Esha Francis, Charles Ma, Jianfeng Ma, Muhammad Abdun Nafi, Mahmud Karim, Muhammad P. Jahan
Proc. ASME. MSEC2023, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T06A015, June 12–16, 2023
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2023-104565
https://doi.org/10.1115/MSEC2023-104565
View Paper titled, An Experimental Investigation on Nanosecond Laser Ablation of Single Crystalline Silicon Wafers
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Topics: Heat, Laser ablation, Lasers, Machining, Semiconductor wafers
Proceedings Papers

Stroboscopic Data-Driven, Integrated, and Intelligent Machine Learning-Based Algorithms for Semiconductor Wafer Inspection

Changheon Han, Heebum Chun, ChaBum Lee, Martin Byung-Guk Jun
Proc. ASME. MSEC2023, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T09A003, June 12–16, 2023
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2023-101213
https://doi.org/10.1115/MSEC2023-101213
View Paper titled, Stroboscopic Data-Driven, Integrated, and Intelligent Machine Learning-Based Algorithms for Semiconductor Wafer Inspection
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Topics: Algorithms, Computers, Inspection, Intelligent machines, Machine learning, Manufacturing, Semiconductor wafers, Particulate matter, Machinery, Human factors
Proceedings Papers

Synthesis and Fabrication of Single Walled Carbon Nanotube Microelectrode Arrays on Flexible Probes for Neurotransmitter Detection

Sei Jin Park, Anna Ivanovskaya, Allison Yorita
Proc. ASME. MSEC2022, Volume 1: Additive Manufacturing; Biomanufacturing; Life Cycle Engineering; Manufacturing Equipment and Automation; Nano/Micro/Meso Manufacturing, V001T07A009, June 27–July 1, 2022
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2022-85273
https://doi.org/10.1115/MSEC2022-85273
View Paper titled, Synthesis and Fabrication of Single Walled Carbon Nanotube Microelectrode Arrays on Flexible Probes for Neurotransmitter Detection
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Topics: Manufacturing, Probes, Single-walled carbon nanotubes, Electrodes, Metals, Carbon, Microfabrication, Resolution (Optics), Carbon nanotubes, Catalysts
Proceedings Papers

A Novel Quality Clustering Methodology on Fab-Wide Wafer Map Images in Semiconductor Manufacturing

Yuan-Ming Hsu, Xiaodong Jia, Wenzhe Li, Jay Lee
Proc. ASME. MSEC2022, Volume 2: Manufacturing Processes; Manufacturing Systems, V002T06A022, June 27–July 1, 2022
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2022-85670
https://doi.org/10.1115/MSEC2022-85670
View Paper titled, A Novel Quality Clustering Methodology on Fab-Wide Wafer Map Images in Semiconductor Manufacturing
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Topics: Integrated circuit fabrication, Semiconductor wafers, Topology, Biomedicine, Manufacturing, Semiconductors (Materials), Visualization
Proceedings Papers

Synthesis of Nano-Dots and Lines by Glancing Angle Deposition With Corrals

Chuang Qu, Shamus McNamara, Kevin Walsh
Proc. ASME. MSEC2022, Volume 1: Additive Manufacturing; Biomanufacturing; Life Cycle Engineering; Manufacturing Equipment and Automation; Nano/Micro/Meso Manufacturing, V001T07A006, June 27–July 1, 2022
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2022-83720
https://doi.org/10.1115/MSEC2022-83720
View Paper titled, Synthesis of Nano-Dots and Lines by Glancing Angle Deposition With Corrals
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Topics: Manufacturing, Nanofabrication, Nanostructures , Nucleation (Physics), Semiconductor wafers, Shades and shadows, Shapes, Vapor deposition, Vapors
Proceedings Papers

Reducing Variability in Chemical Vapor Deposition of Carbon Nanotubes Based on Gas Purification and Sample Support Redesign

Golnaz Tomaraei, Moataz Abdulhafez, Jaegeun Lee, Mostafa Bedewy
Proc. ASME. MSEC2020, Volume 1: Additive Manufacturing; Advanced Materials Manufacturing; Biomanufacturing; Life Cycle Engineering; Manufacturing Equipment and Automation, V001T03A020, September 3, 2020
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2020-8388
https://doi.org/10.1115/MSEC2020-8388
View Paper titled, Reducing Variability in Chemical Vapor Deposition of Carbon Nanotubes Based on Gas Purification and Sample Support Redesign
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Topics: Carbon nanotubes, Chemical vapor deposition, Design, Semiconductor wafers, Carbon, Density, Gas flow, Helium, Oxygen, Plumbing
Proceedings Papers

Multi-Objective Optimization of Wire Electrical Discharge Machined Ultra-Thin Silicon Wafers Using Response Surface Methodology for Solar Cell Applications

Pinal Rana, Divyanshu Bhartiya, Meinam Annebushan Singh, Deepak Marla
Proc. ASME. MSEC2020, Volume 2: Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T08A021, September 3, 2020
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2020-8489
https://doi.org/10.1115/MSEC2020-8489
View Paper titled, Multi-Objective Optimization of Wire Electrical Discharge Machined Ultra-Thin Silicon Wafers Using Response Surface Methodology for Solar Cell Applications
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Topics: Composite materials, Electrical discharge machining, Pareto optimization, Response surface methodology, Semiconductor wafers, Solar cells, Wire
Proceedings Papers

Regional Manufacturing Cost Structures and Supply Chain Considerations for Medium Voltage Silicon Carbide Power Applications

Samantha Reese, Margaret Mann, Timothy Remo, Kelsey Horowitz
Proc. ASME. MSEC2018, Volume 2: Materials; Joint MSEC-NAMRC-Manufacturing USA, V002T07A004, June 18–22, 2018
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2018-6601
https://doi.org/10.1115/MSEC2018-6601
View Paper titled, Regional Manufacturing Cost Structures and Supply Chain Considerations for Medium Voltage Silicon Carbide Power Applications
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Topics: Manufacturing, Silicon, Supply chains, Collaboration, Energy gap, Motor drives, Semiconductor wafers, Semiconductors (Materials)
Proceedings Papers

Investigation on Smoothing Silicon Carbide Wafer With a Combined Method of Mechanical Lapping and Photocatalysis Assisted Chemical Mechanical Polishing

Zewei Yuan, Kai Cheng, Yan He, Meng Zhang
Proc. ASME. MSEC2018, Volume 4: Processes, V004T03A002, June 18–22, 2018
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2018-6615
https://doi.org/10.1115/MSEC2018-6615
View Paper titled, Investigation on Smoothing Silicon Carbide Wafer With a Combined Method of Mechanical Lapping and Photocatalysis Assisted Chemical Mechanical Polishing
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Topics: Grinding, Polishing, Semiconductor wafers, Silicon, Surface roughness, Crystals, Electron capture, Integrated circuits, Irradiation (Radiation exposure), Optoelectronic devices
Proceedings Papers

Empirical Modeling of Material Removal Considering Tool Condition in Chemical Mechanical Planarization Process

Zhenhua Wu
Proc. ASME. MSEC2017, Volume 3: Manufacturing Equipment and Systems, V003T04A070, June 4–8, 2017
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2017-3027
https://doi.org/10.1115/MSEC2017-3027
View Paper titled, Empirical Modeling of Material Removal Considering Tool Condition in Chemical Mechanical Planarization Process
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Topics: Artificial neural networks, Errors, Flow (Dynamics), Integrated circuit fabrication, Modeling, Polishing, Pressure, Rotation, Semiconductor wafers, Slurries
Proceedings Papers

Plasmonic Nanofocusing in Deep and Extreme Sub-Wavelength Scale for Scalable Nanolithography

Zhidong Du, Chen Chen, Liang Pan
Proc. ASME. MSEC2017, Volume 3: Manufacturing Equipment and Systems, V003T04A072, June 4–8, 2017
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2017-2680
https://doi.org/10.1115/MSEC2017-2680
View Paper titled, Plasmonic Nanofocusing in Deep and Extreme Sub-Wavelength Scale for Scalable Nanolithography
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Topics: Nanolithography, Wavelength, Nanoscale phenomena, Lithography, Resolution (Optics), Air bearings, Design, Imaging, Lenses (Optics), Mass production
Proceedings Papers

A Method to Manufacture Repeatible Graphene-Based NEMS Devices at the Wafer-Scale

Joon Hyong Cho, Guoao Sun, Michael Cullinan
Proc. ASME. MSEC2016, Volume 1: Processing, V001T02A077, June 27–July 1, 2016
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2016-8567
https://doi.org/10.1115/MSEC2016-8567
View Paper titled, A Method to Manufacture Repeatible Graphene-Based NEMS Devices at the Wafer-Scale
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Topics: Graphene, Nanoelectromechanical devices, Semiconductor wafers, Manufacturing, Tension, Microelectromechanical systems, Actuators, Displacement, Nanomechanical resonators, Electrodes
Proceedings Papers

Micro-Machinability Studies of Single Crystal Silicon Using Diamond End-Mill

Zi Jie Choong, Dehong Huo, Patrick Degenaar, Anthony O’Neill
Proc. ASME. MSEC2016, Volume 1: Processing, V001T02A004, June 27–July 1, 2016
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2016-8622
https://doi.org/10.1115/MSEC2016-8622
View Paper titled, Micro-Machinability Studies of Single Crystal Silicon Using Diamond End-Mill
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Topics: Crystals, Diamonds, Machinability, Silicon, Machining, Cutting, Micromilling, Semiconductor wafers, Size effect, Brittleness
Proceedings Papers

Scalable Plasmonic Nanolithography: Prototype System Design and Construction

Yuan Wang, Mohamed E. Saad, Kang Ni, Yen Chi Chang, Cheng-Wei Chen, Chen Chen, Liang Pan, Tsu Chin Tsao, Adrienne S. Lavine, David B. Bogy, Xiang Zhang
Proc. ASME. MSEC2016, Volume 1: Processing, V001T02A081, June 27–July 1, 2016
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2016-8671
https://doi.org/10.1115/MSEC2016-8671
View Paper titled, Scalable Plasmonic Nanolithography: Prototype System Design and Construction
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Topics: Construction, Design, Engineering prototypes, Nanolithography, Lithography, Metrology, Air bearings, Imaging, Mass production, Nanoscale phenomena
Proceedings Papers

Three-Dimensional Modification in Silicon With Infrared Nanosecond Laser

Xiaoming Yu, Carlos A. Trallero-Herrero, David Grojo, Shuting Lei
Proc. ASME. MSEC2016, Volume 1: Processing, V001T02A030, June 27–July 1, 2016
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2016-8686
https://doi.org/10.1115/MSEC2016-8686
View Paper titled, Three-Dimensional Modification in Silicon With Infrared Nanosecond Laser
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Topics: Lasers, Silicon, Absorption, Chemical etching, Cross section (Physics), Damage, Density, Dielectric materials, Laser beams, Lenses (Optics)