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Proceedings Papers

Sustainable Analysis of Energy Consumption and Surface Quality of Monocrystalline Silicon in Diamond Wire Sawing

Eyob Messele Sefene, Chao-Chang Arthur Chen, Steve Hsueh-Ming Wang
Proc. ASME. MSEC2023, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T06A002, June 12–16, 2023
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2023-101247
https://doi.org/10.1115/MSEC2023-101247
View Paper titled, Sustainable Analysis of Energy Consumption and Surface Quality of Monocrystalline Silicon in Diamond Wire Sawing
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Topics: Carbon dioxide, Diamonds, Emissions, Energy consumption, Sawing, Silicon, Surface quality, Surface roughness, Sustainability, Wire
Proceedings Papers

A Preliminary Numerical Study of the Slurry Wire Sawing Process

Chunhui Chung
Proc. ASME. MSEC2012, ASME 2012 International Manufacturing Science and Engineering Conference, 119-125, June 4–8, 2012
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2012-7289
https://doi.org/10.1115/MSEC2012-7289
View Paper titled, A Preliminary Numerical Study of the Slurry Wire Sawing Process
Open the PDF for A Preliminary Numerical Study of the Slurry Wire Sawing Process in another window
Topics: Sawing, Slurries, Wire, Brittleness, Semiconductor wafers, Stress, Computer simulation, Fracture (Materials), Sawing machines, Simulation results