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Proceedings Papers

Friction Stir Diffusion Bonding of Magnesium Alloy ZK 60 to Steel

Fadi Al-Badour, Abdulrahman Alghamdi, Akeem Y. Adesina, Rami K. Suleiman, Neçar Merah
Proc. ASME. MSEC2021, Volume 2: Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T06A003, June 21–25, 2021
Paper No: MSEC2021-60179
DOI: https://doi.org/10.1115/MSEC2021-60179
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Topics: Diffusion bonding (Metals), Friction, Magnesium alloys, Steel, Welding
Proceedings Papers

Optimizing Process Conditions in Friction Stir-Diffusion Lap Welding of Aluminum Alloy With Cold Rolled Steel

Fadi Al-Badour, Necar Merah, Omer Mohamed, Abdelaziz Bazoune, Abdelrahman Shuaib
Proc. ASME. MSEC2018, Volume 2: Materials; Joint MSEC-NAMRC-Manufacturing USA, V002T04A046, June 18–22, 2018
Paper No: MSEC2018-6711
DOI: https://doi.org/10.1115/MSEC2018-6711
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Topics: Aluminum alloys, Diffusion (Physics), Friction, Steel, Welding, Cladding systems (Building), Diffusion bonding (Metals), Knudsen number, Shear (Mechanics), Stiffness
Proceedings Papers

Measurement of Transient Tool Internal Temperature Fields During Hard Turning by Embedded Thin Film Sensors

Dirk Werschmoeller, Xiaochun Li, Kornel Ehmann
Proc. ASME. MSEC2011, ASME 2011 International Manufacturing Science and Engineering Conference, Volume 2, 297-306, June 13–17, 2011
Paper No: MSEC2011-50297
DOI: https://doi.org/10.1115/MSEC2011-50297
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Topics: Temperature, Thin film sensors, Transients (Dynamics), Turning, Cutting, Bonding, Machining, Martensitic steel, Sensors, Thermocouples
Proceedings Papers

Development of an Axisymmetric Pressure Application Method for Cylindrical Laminated Device Fabrication

James H. Vlieg, Brian K. Paul, Richard B. Peterson
Proc. ASME. MSEC2010, ASME 2010 International Manufacturing Science and Engineering Conference, Volume 2, 355-362, October 12–15, 2010
Paper No: MSEC2010-34227
DOI: https://doi.org/10.1115/MSEC2010-34227
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Topics: Manufacturing, Pressure, Bonding, Microchannels, Blood, Cycles, Design, Diffusion bonding (Metals), Engines, Finite element analysis
Proceedings Papers

Measurement of Tool Internal Temperatures in the Tool-Chip Contact Region by Embedded Thin Film Micro Thermocouples

Dirk Werschmoeller, Xiaochun Li
Proc. ASME. MSEC2010, ASME 2010 International Manufacturing Science and Engineering Conference, Volume 1, 371-377, October 12–15, 2010
Paper No: MSEC2010-34176
DOI: https://doi.org/10.1115/MSEC2010-34176
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Topics: Temperature, Thermocouples, Thin films, Machining, Bonding, Cutting, Sensors, Thermomechanics, Boron, Diffusion bonding (Metals)
Proceedings Papers

Manufacture of Aerospace Components With Pressure Welding

Ho-Sung Lee, Jong-Hoon Yoon, Young-Moo Yi
Proc. ASME. MSEC2010, ASME 2010 International Manufacturing Science and Engineering Conference, Volume 1, 591-598, October 12–15, 2010
Paper No: MSEC2010-34056
DOI: https://doi.org/10.1115/MSEC2010-34056
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Topics: Aerospace industry, Diffusion bonding (Metals), Pressure, Welding
Proceedings Papers

Micro Thin Film Thermal Sensors Embedded Into Polycrystalline Cubic Boron Nitride (PCBN) for Advanced Machining Study

Dirk Werschmoeller, Xiaochun Li
Proc. ASME. MSEC2009, ASME 2009 International Manufacturing Science and Engineering Conference, Volume 2, 105-111, October 4–7, 2009
Paper No: MSEC2009-84332
DOI: https://doi.org/10.1115/MSEC2009-84332
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Topics: Boron, Machining, Sensors, Thin films, Cutting, Temperature, Bonding, Thermomechanics, Carbon steel, Cutting tools
Proceedings Papers

Application of Nickel Nanoparticles in Diffusion Bonding of Stainless Steel Surfaces

Santosh K. Tiwari, Brian K. Paul
Proc. ASME. MSEC2008, ASME 2008 International Manufacturing Science and Engineering Conference, Volume 2, 441-446, October 7–10, 2008
Paper No: MSEC_ICM&P2008-72151
DOI: https://doi.org/10.1115/MSEC_ICMP2008-72151
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Topics: Diffusion bonding (Metals), Nanoparticles, Nickel, Stainless steel, Bonding, Bond strength, Diffusion (Physics), ASTM standards, Brazing, Brittleness
Proceedings Papers

Embedding of Micro Thin Film Sensors Into Polycrystaline Cubic Boron Nitride (PCBN) for Potential Tooling Applications Via Diffusion Bonding

Dirk Werschmoeller, Xiaochun Li
Proc. ASME. MSEC2008, ASME 2008 International Manufacturing Science and Engineering Conference, Volume 2, 287-292, October 7–10, 2008
Paper No: MSEC_ICM&P2008-72504
DOI: https://doi.org/10.1115/MSEC_ICMP2008-72504
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Topics: Boron, Diffusion bonding (Metals), Thin film sensors, Tooling, Sensors, Manufacturing, Alloys, Design, Microfabrication, Palladium
Proceedings Papers

Applications of Micro Sensors for Fundamental Study of Manufacturing Processes

Xudong Cheng, Hongseok Choi, Xiaochun Li
Proc. ASME. MSEC2007, ASME 2007 International Manufacturing Science and Engineering Conference, 281-288, October 15–18, 2007
Paper No: MSEC2007-31164
DOI: https://doi.org/10.1115/MSEC2007-31164
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Topics: Manufacturing, Microsensors, Diffusion bonding (Metals), Instrumentation, Lasers, Metals, Micromachining, Thermomechanics, Thin film sensors, Ultrasonic welding