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Proceedings Papers

Friction Stir Diffusion Bonding of Magnesium Alloy ZK 60 to Steel

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Fadi Al-Badour, Abdulrahman Alghamdi, Akeem Y. Adesina, Rami K. Suleiman, Neçar Merah
Proc. ASME. MSEC2021, Volume 2: Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T06A003, June 21–25, 2021
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2021-60179
https://doi.org/10.1115/MSEC2021-60179
View Paper titled, Friction Stir Diffusion Bonding of Magnesium Alloy ZK 60 to Steel
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Topics: Diffusion bonding (Metals), Friction, Magnesium alloys, Steel, Welding
Proceedings Papers

Optimizing Process Conditions in Friction Stir-Diffusion Lap Welding of Aluminum Alloy With Cold Rolled Steel

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Fadi Al-Badour, Necar Merah, Omer Mohamed, Abdelaziz Bazoune, Abdelrahman Shuaib
Proc. ASME. MSEC2018, Volume 2: Materials; Joint MSEC-NAMRC-Manufacturing USA, V002T04A046, June 18–22, 2018
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2018-6711
https://doi.org/10.1115/MSEC2018-6711
View Paper titled, Optimizing Process Conditions in Friction Stir-Diffusion Lap Welding of Aluminum Alloy With Cold Rolled Steel
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Topics: Aluminum alloys, Diffusion (Physics), Friction, Steel, Welding, Cladding systems (Building), Diffusion bonding (Metals), Knudsen number, Shear (Mechanics), Stiffness
Proceedings Papers

Measurement of Transient Tool Internal Temperature Fields During Hard Turning by Embedded Thin Film Sensors

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Dirk Werschmoeller, Xiaochun Li, Kornel Ehmann
Proc. ASME. MSEC2011, ASME 2011 International Manufacturing Science and Engineering Conference, Volume 2, 297-306, June 13–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2011-50297
https://doi.org/10.1115/MSEC2011-50297
View Paper titled, Measurement of Transient Tool Internal Temperature Fields During Hard Turning by Embedded Thin Film Sensors
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Topics: Temperature, Thin film sensors, Transients (Dynamics), Turning, Cutting, Bonding, Machining, Martensitic steel, Sensors, Thermocouples
Proceedings Papers

Development of an Axisymmetric Pressure Application Method for Cylindrical Laminated Device Fabrication

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James H. Vlieg, Brian K. Paul, Richard B. Peterson
Proc. ASME. MSEC2010, ASME 2010 International Manufacturing Science and Engineering Conference, Volume 2, 355-362, October 12–15, 2010
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2010-34227
https://doi.org/10.1115/MSEC2010-34227
View Paper titled, Development of an Axisymmetric Pressure Application Method for Cylindrical Laminated Device Fabrication
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Topics: Manufacturing, Pressure, Bonding, Microchannels, Blood, Cycles, Design, Diffusion bonding (Metals), Engines, Finite element analysis
Proceedings Papers

Manufacture of Aerospace Components With Pressure Welding

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Ho-Sung Lee, Jong-Hoon Yoon, Young-Moo Yi
Proc. ASME. MSEC2010, ASME 2010 International Manufacturing Science and Engineering Conference, Volume 1, 591-598, October 12–15, 2010
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2010-34056
https://doi.org/10.1115/MSEC2010-34056
View Paper titled, Manufacture of Aerospace Components With Pressure Welding
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Topics: Aerospace industry, Diffusion bonding (Metals), Pressure, Welding
Proceedings Papers

Measurement of Tool Internal Temperatures in the Tool-Chip Contact Region by Embedded Thin Film Micro Thermocouples

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Dirk Werschmoeller, Xiaochun Li
Proc. ASME. MSEC2010, ASME 2010 International Manufacturing Science and Engineering Conference, Volume 1, 371-377, October 12–15, 2010
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2010-34176
https://doi.org/10.1115/MSEC2010-34176
View Paper titled, Measurement of Tool Internal Temperatures in the Tool-Chip Contact Region by Embedded Thin Film Micro Thermocouples
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Topics: Temperature, Thermocouples, Thin films, Machining, Bonding, Cutting, Sensors, Thermomechanics, Boron, Diffusion bonding (Metals)
Proceedings Papers

Micro Thin Film Thermal Sensors Embedded Into Polycrystalline Cubic Boron Nitride (PCBN) for Advanced Machining Study

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Dirk Werschmoeller, Xiaochun Li
Proc. ASME. MSEC2009, ASME 2009 International Manufacturing Science and Engineering Conference, Volume 2, 105-111, October 4–7, 2009
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2009-84332
https://doi.org/10.1115/MSEC2009-84332
View Paper titled, Micro Thin Film Thermal Sensors Embedded Into Polycrystalline Cubic Boron Nitride (PCBN) for Advanced Machining Study
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Topics: Boron, Machining, Sensors, Thin films, Cutting, Temperature, Bonding, Thermomechanics, Carbon steel, Cutting tools
Proceedings Papers

Application of Nickel Nanoparticles in Diffusion Bonding of Stainless Steel Surfaces

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Santosh K. Tiwari, Brian K. Paul
Proc. ASME. MSEC2008, ASME 2008 International Manufacturing Science and Engineering Conference, Volume 2, 441-446, October 7–10, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MSEC_ICM&P2008-72151
https://doi.org/10.1115/MSEC_ICMP2008-72151
View Paper titled, Application of Nickel Nanoparticles in Diffusion Bonding of Stainless Steel Surfaces
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Topics: Diffusion bonding (Metals), Nanoparticles, Nickel, Stainless steel, Bonding, Bond strength, Diffusion (Physics), ASTM standards, Brazing, Brittleness
Proceedings Papers

Embedding of Micro Thin Film Sensors Into Polycrystaline Cubic Boron Nitride (PCBN) for Potential Tooling Applications Via Diffusion Bonding

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Dirk Werschmoeller, Xiaochun Li
Proc. ASME. MSEC2008, ASME 2008 International Manufacturing Science and Engineering Conference, Volume 2, 287-292, October 7–10, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MSEC_ICM&P2008-72504
https://doi.org/10.1115/MSEC_ICMP2008-72504
View Paper titled, Embedding of Micro Thin Film Sensors Into Polycrystaline Cubic Boron Nitride (PCBN) for Potential Tooling Applications Via Diffusion Bonding
Open the PDF for Embedding of Micro Thin Film Sensors Into Polycrystaline Cubic Boron Nitride (PCBN) for Potential Tooling Applications Via Diffusion Bonding in another window
Topics: Boron, Diffusion bonding (Metals), Thin film sensors, Tooling, Sensors, Manufacturing, Alloys, Design, Microfabrication, Palladium
Proceedings Papers

Applications of Micro Sensors for Fundamental Study of Manufacturing Processes

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Xudong Cheng, Hongseok Choi, Xiaochun Li
Proc. ASME. MSEC2007, ASME 2007 International Manufacturing Science and Engineering Conference, 281-288, October 15–18, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2007-31164
https://doi.org/10.1115/MSEC2007-31164
View Paper titled, Applications of Micro Sensors for Fundamental Study of Manufacturing Processes
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Topics: Manufacturing, Microsensors, Diffusion bonding (Metals), Instrumentation, Lasers, Metals, Micromachining, Thermomechanics, Thin film sensors, Ultrasonic welding